Two-dimensional particle-in-cell simulation parallelized with graphics processing units for the investigation of plasma kinetics in a dual-frequency capacitively coupled plasma

Ji Hyun Shin1, Hwanho Kim2, Hae June Lee2
1Pusan National University
2Department of Electrical Engineering, Pusan National University, Busan, Republic of Korea

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N.Y. Babaeva, M.J. Kushner, J. Appl. Phys. 101, 113307 (2007)

N.Y. Babaeva, M.J. Kushner, J. Phys. D Appl. Phys. 41, 062004 (2008)

K. Bera, B. Farouk, Y.H. Lee, Plasma Sour. Sci. Technol. 10, 211 (2001)

C.K. Birdsall, IEEE Trans. Plasma Sci. 19, 65 (1991)

J.P. Booth, G. Cunge, N. Sadeghi, R.W. Boswell, J. Appl. Phys. 82, 552 (1997)

E. Bultinck, A. Bogaerts, New J. Phys. 11, 103010 (2009)

Z. Donkó, J. Schulze, B.G. Heil, U. Czarnetzki, J. Phys. D Appl. Phys. 42, 025205 (2009)

T. Gans, J. Schulze, D. O’Connell, U. Czarnetzki, R. Faulkner, A.R. Ellingboe, M.M. Turner, Appl. Phys. Lett. 89, 261502 (2006)

V. Georgieva, A. Bogaerts, R. Gijbels, J. Appl. Phys. 93, 2369 (2003)

V.A. Godyak, R.B. Piejak, Phys. Rev. Lett. 65, 996 (1990)

H.H. Goto, H. Löwe, T. Ohmi, J. Vac. Sci. Technol. A 10, 3048 (1992)

D. Hegemann, M. Michlíček, N.E. Blanchard, U. Shültz, D. Lohmann, M. Vandenbossche, L. Zajíčková, M. Drábik, Plasma Processes Polym. 13, 279 (2016)

M.Y. Hur, J.S. Kim, I.C. Song, J.P. Verboncoeur, H.J. Lee, Plasma Res. Express 1, 015016 (2019)

S. Hwang, K. Kanarik, https://sst.semiconductor-digest.com/2016/08/evolution-of-across-wafer-uniformity-control-in-plasma-etch/

Y.H. Jo, H.S. Park, M.Y. Hur, H.J. Lee, AIP Adv. 10, 125224 (2020)

Y.H. Jo, C. Cheon, H. Park, M.Y. Hur, H.J. Lee, J. Kor. Phys. Soc. 80, 787 (2022)

E. Kawamura, M.A. Lieberman, A.J. Lichtenberg, Phys. Plasmas. 13, 053506 (2006)

D. Kim, D.J. Economou, IEEE Trans. Plasma Sci. 30, 2048 (2002)

H.J. Kim, H.J. Lee, Plasma Sour. Sci. Technol. 25, 035006 (2016a)

H.J. Kim, H.J. Lee, Plasma Sour. Sci. Technol. 25, 065006 (2016b)

H.J. Kim, H.J. Lee, Plasma Sour. Sci. Technol. 26, 085003 (2017a)

H.J. Kim, H.J. Lee, J. Appl. Phys. 122, 053301 (2017b)

H.J. Kim, H.J. Lee, J. Appl. Phys. 123, 113302 (2018)

D. Kim, D.J. Economou, J.R. Woodworth, P.A. Miller, R.J. Shul, B.P. Aragon, T.W. Hamilton, C.G. Willison, IEEE Trans. Plasma Sci. 31, 691 (2003)

H.C. Kim, O. Manuilenko, J.K. Lee, Jpn. J. Appl. Phys. 44, 1957 (2005a)

H. C. Kim, F. Iza, S. S. Yang, M. Radmilovi$$\acute{\rm c}$$-Radjenovi$$\acute{\rm c}$$, and J. K. Lee, J. Phys. D: Appl. Phys. 38, R283 (2005b)

H.J. Kim, W. Yang, J. Joo, J. Appl. Phys. 118, 043304 (2015)

J.S. Kim, M.Y. Hur, C.H. Kim, H.J. Kim, H.J. Lee, J. Phys. D Appl. Phys. 51, 104004 (2018)

H.J. Kim, J.S. Kim, H.J. Lee, J. Appl. Phys. 126, 173301 (2019a)

J.S. Kim, M.Y. Hur, C.H. Kim, H.J. Kim, H.J. Lee, J. Appl. Phys. 126, 233301 (2019b)

C.H. Kim, H. Kim, G. Park, H.J. Lee, Plasma Sour. Sci. Technol. 30, 065031 (2021)

C.H. Kim, J.S. Kim, M.Y. Hur, Y. Sakiyama, H.J. Lee, Plasma Sour. Sci. Technol. 30, 075005 (2021a)

C. H. Kim, H. Kim, G.Park, J. H. Shin, H. J. Lee, Plasma Processes Polym., e2100196 (2022b)

T. Kitajima, Y. Takeo, Z.. Lj.. Petrović, T. Makabe, Appl. Phys. Lett. 77, 489 (2000)

A. Koshiishi, Y. Araki, S. Himori, T. Iijima, J. Appl. Phys. 40, 6613 (2001)

T. Lafleur, P.A. Delattre, E.V. Johnson, J.P. Booth, Appl. Phys. Lett. 101, 124104 (2012)

J.K. Lee, O.V. Manuilenko, N.Y. Babaeva, H.C. Kim, J.W. Shon, Plasma Sour. Sci. Technol. 14, 89 (2005)

S.H. Lee, F. Iza, J.K. Lee, Phys. Plasmas. 13, 057102 (2006)

J.Y. Lee, H.Y. Bae, H.J. Lee, J.P. Verboncoeur, Plasma Sour. Sci. Technol. 23, 035017 (2014)

J.Y. Lee, J.P. Verboncoeur, H.J. Lee, Plasma Sour. Sci. Technol 27, 04LT01 (2018)

M. A. Lierberman, A. J. Lichtenberg, Principles of plasma discharges and materials processing (Wiley, 2002)

Y. Liu, J.-P. Booth, P. Chabert, Plasma Sour. Sci. Technol. 27, 025006 (2018)

G.J. Nienhuis, W. Goedheer, Plasma Sour. Sci. Technol. 8, 295 (1999)

NVIDIA Corporation, CUDA C++ Programming Guide, Ver.11.5 (2021)

Y. Ohtsu, N. Matsumoto, J. Schulze, E. Schüngel, Phys. Plasmas. 23, 033510 (2016)

S. Rauf, Plasma Sour. Sci. Technol. 29, 095019 (2019)

S. Rauf, P. Tian, J. Kenney, L. Dorf, J. Vac. Sci. Technol. B 40, 032202 (2022)

S.M. Rossnagel, J.J. Cuomo, W.D. Westwood, Handbook of Plasma Processing Technology (Noyes Publications, New York, 1990)

N. Schmidt, J. Schulze, E. Schüngel, U. Czarnetzki, J. Phys. D Appl. Phys. 46, 505202 (2013)

J. Schulze, Z. Donkó, E. Schüngel, U. Czarnetzki, Plasma Sour. Sci. Technol. 20, 045007 (2011)

M.M. Turner, P. Chabert, Phys. Rev. Lett. 96, 205001 (2006)

V. Vahedi, M. Surendra, Comput. Phys. Commun. 87, 179 (1995)

J.P. Verboncoeur, Plasma Phys. Control. Fus. 47, A231 (2005)

G. Wakayama, K. Nanbu, IEEE Trans. Plasma Sci. 31, 638 (2003)

L. Wang, P. Hartmann, Z. Donkó, Y.H. Song, J. Schulze, J. Vac. Sci. Technol. A. 39, 063004 (2021)