Thermoelectric properties of indium doped Cu2CdSnSe4

Intermetallics - Tập 72 - Trang 17-24 - 2016
Raju Chetty1, Ashoka Bali1, Ramesh Chandra Mallik1
1Thermoelectric Materials and Devices Laboratory, Department of Physics, Indian Institute of Science, Bangalore, 560012, India

Tài liệu tham khảo

Liu, 2009, Adv. Mater, 21, 3808, 10.1002/adma.200900409 Guen, 1979, Mater. Res. Bull., 14, 463, 10.1016/0025-5408(79)90186-7 Konstantinova, 1989, Izv. Akad. Nauk. SSSR, Neorg. Mater., 5, 1166 Mkrtchyan, 1988, Izv. Akad. Nauk. SSSR, Neorg. Mater., 24, 10941096 Liu, 2014, Sci. Rep., 4, 5774, 10.1038/srep05774 Chetty, 2015, Intermetallics, 57, 156, 10.1016/j.intermet.2014.10.015 Shi, 2009, Appl. Phys. Lett., 94, 122103, 10.1063/1.3103604 Liu, 2009, Appl. Phys. Lett., 94, 202103, 10.1063/1.3130718 Zeier, 2012, J. Am. Chem. Soc., 134, 7147, 10.1021/ja301452j Chetty, 2015, J. Electron. Mater., 1 Raju, 2013, AIP Adv., 3, 032106, 10.1063/1.4794733 Chetty, 2013, Phys. Status Solidi A, 210, 2471, 10.1002/pssa.201329264 Fan, 2011, J. Am. Chem. Soc., 133, 15910, 10.1021/ja207159j Ibanez, 2012, Chem. Mater., 24, 562, 10.1021/cm2031812 Ibanez, 2012, J. Am.Chem. Soc., 134, 4060, 10.1021/ja211952z Dong, 2013, Inorg. Chem., 52, 14364, 10.1021/ic402455x Navrátil, 2014, J. Electron. Mater., 1 Roisnel, 2001, Mater. Sci. Forum, 378–381, 118, 10.4028/www.scientific.net/MSF.378-381.118 Nakamura, 2011, Jpn. J. Appl. Phys., 50, 05FF01, 10.7567/JJAP.50.05FF01 Liu, 2014, Sci. Rep., 4 Olekseyuk, 2002, J. Alloys Compd., 340, 141, 10.1016/S0925-8388(02)00006-3 Shannon, 1976, Acta Crystallogr. Sect. A, 32, 751, 10.1107/S0567739476001551 Tomashyk, 2014 Rowe, 1983 Mohanchandra, 1997, Thin Solid Films, 305, 124, 10.1016/S0040-6090(97)00188-0 Chate, 2013, J. Mater Sci. Mater Electron, 24, 2000, 10.1007/s10854-012-1048-3 Wibowo, 2007, Phys. Stat. Sol.(a), 204, 3373, 10.1002/pssa.200723144 Heinz, 1956, J. Chem. Phys., 24, 391, 10.1063/1.1742484 Burger, 1984, J. Cryst. Growth, 67, 507, 10.1016/0022-0248(84)90044-7 Okamoto, 1969, Jpn. J. Appl. Phys., 8, 718, 10.1143/JJAP.8.718