Thermal placement of elements of integrated circuits on crystal surface
Tóm tắt
The criterion and the corresponding approach for the thermal placement of integrated circuits (IC) elements on the crystal surface are proposed. The criterion of placement is identical to the traditional criteria of minimizing the total length of connections between elements, which at the placement stage enables to apply an additive multiparametric criterion of joint consideration of electrical and thermal modes for operating of the IC elements.
Tài liệu tham khảo
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