The optimum projection angle of fringe projection for ball grid array inspection based on reflectance analysis

ZhuCheng Li1, Young Chang Kang2, Jun-Hee Moon3, Heui Jae Pahk4
1Institute of Advanced Machinery and Design, Seoul National University, Seoul, South Korea
2Department of Physics Education, Seoul National University, Seoul, South Korea
3Department of Mechanical Design, Yuhan University, Bucheon-si, South Korea
4School of Mechanical and Aerospace Engineering, Seoul National University, Seoul, South Korea

Tóm tắt

A solder bump is regarded as a specular-dominant shiny component that distorts the height profile and causes poor repeatability during the bump height measurement. In this paper, we analyze the relationship between the projection angle and other factors based on the general reflectance mechanism of the specular surface. An optimum projection angle exists, such that can produce the best repeatability of the bump height measurement; therefore, we propose a convenient experimental system with a circular motion guide that can evaluate the optimum projection angle experimentally. The experimental results show that best repeatability is obtained with the optimum projection angle. The proposed method to find the optimum projection angle in this paper can therefore be applied to the many cases of measurement for ball grid array samples having specular-dominant shiny component.

Tài liệu tham khảo

Srinivasan V, Liu HC, Halioua M (1984) Automated phase-measuring profilometry of 3-D diffuse objects. Appl Optics 23:3105–3108 Gorthi SS, Rastogi P (2009) Fringe projection techniques: whither we are? Opt Lasers Eng 48(2):133–140 Yen HN, Tsai DM (2004) A fast full-field 3D measurement system for BGA coplanarity inspection. Int J Adv Manuf Technol 24(1–2):132–139 Wolfe LB (1987) Spectral and polarization stereo methods using a single light source, in Proceedings of the IEEE first International Conference on Computer Vision (ICCV): 708–715 Hu Q, Harding KG, Du X Hamilton D (2005) Shiny parts measurement using color separation. Proc. SPIE 6000, 6000D1–8 Zhang S, Yau ST (2009) High dynamic range scanning technique. Opt Eng 48(3) Vargas J, Koninckx T, Quiroga JA, Gool LV (2008) Three-dimensional measurement of microchips using structured light techniques. Opt Eng 47(5) Takeda M, Ina H, Kobayashi S (1982) Fourier-transform method of fringe pattern analysis for computer-based topography and interferometry. J Opt Soc Am 72:156–160 Horn BKP (1977) Understanding image intensities. Artific Intell 8(11):201–231 Horn BKP, Sjoberg RW (1979) Calculating the reflectance map. Appl Optics 18(1):1170–1779 Nayar SK, Sanderson AC, Weiss LE, Simon DA (1990) Specular surface inspection using structured highlight and Gaussian images. IEEE Trans Rob Autom 6(2):208–218 Zhang S, Yau ST (2007) Generic nonsinusoidal phase error correction for three-dimensional shape measurement using a digital video projector. Appl Optics 46(1):36–43 Notni GH, Notni G (2003) Digital fringe projection in 3D shape measurement—an error analysis. Proc SPIE 5114:372–380 Zhang S, Huang PS (2007) Phase error compensation for a three-dimensional shape measurement system based on the phase shifting method. Opt Eng 46(6):063601 Guo H, He H, Chen M (2004) Gamma correction for digital fringe projection profilometry. Appl Opt 43(14):2906–2914