A. Thomas, Nucleonics 13(11), 33–129 (1955)
R. G. Lange, W. P. Carroll, Energy Convers. Manag. 49(3), 393–401 (2008)
G. Di Bari, in Nickel Plating, Surface Engineering. ASM Handbook, vol. 5 (ASM International, Materials Park, OH, 1994, edited by C. M. Cotell, J. A. Sprague, F. A. Smidt), p. 201
R. Orinakova, A. Turonova, M.G. Kladekova, R.M. Smith, J. Appl. Electrochem. 36(9), 957–972 (2006)
C.Q. Cui, J.Y. Lee, Electrochemica Acta 40(11), 1653–1662 (1955)
A.M. Rashidi, A. Amadeh, Surf. Coat. Technol. 204(3), 353–358 (2009)
G.A. Di Bari, M. Schlesinger, M. Paunovic, Modern Electroplating, 4th edn. (Wiley, New York, 2000), pp. 139–199
D. Landolt, J. Electroanal. Chem. 149(3), S9 (2002)
S.C. Tjong, H. Chen, Mater. Sci. Eng. R 45(1–2), 1–88 (2004)
F. Ebrahimi, Z. Ahmed, J. Appl. Electrochem. 33(8), 733–739 (2003)
S.T. Aruna, S. Diwakar, A. Jain, K.S. Rajam, Surf. Eng. 21(3), 209–214 (2005)
G.L. Flx, J.D. Pollack, Anal. Chem. 52(11), 1589–1592 (1980)
A.M. El-Sherik, U. Erb, J. Mater. Sci. 30(22), 5743–5749 (1995)
Y.R. Uhm, J.H. Park, W.W. Kim, C.-H. Cho, C.K. Rhee, Mater. Sci. Eng. B 106(3), 224–227 (2004)
T.C. Franklin, Surf. Coat. Technol. 30(4), 415–428 (1987)
G.-Y. Park, Y.R. uhm, S. Choi, D.-Y. Park, J. Kor. Magn. Soc. 23(1), 12–17 (2013) (in Korean)
L. Oniciu, L. Muresan, J. Appl. Electrochem. 21(7), 565–574 (1991)
Y. Nakamura, N. Kaneko, M. Watanabe, H. Nezu, J. Appl. Electrochem. 24(3), 227–232 (1994)