The effects of current density and saccharin addition on the grain size of electroplated nickel

Research on Chemical Intermediates - Tập 41 - Trang 4141-4149 - 2014
Young Rang Uhm1, Keun Yung Park1, Sun Ju Choi1
1Radioisotope Research Division, Korea Atomic Energy Research Institute (KAERI), Daejeon, Republic of Korea

Tóm tắt

Nanocrystalline nickel (Ni) coatings were synthesized by direct current electrodeposition at current density from 1 to 30 mA/cm2 and pH 4. The basic composition of the bath, which was prepared by dissolving Ni metal particles in HCl, was 0.2 M Ni ions. The effects of the current density and saccharin addition on the average particle size of Ni deposits were investigated by XRD and SEM techniques. The results showed that the surface roughness decreased as the saccharin concentration increased to 2 g/l, while a further increase in saccharin concentration had no significant effect. The current density for deposition of Ni was increased as the saccharin concentration increased. The experimental results showed that the increase in the current density had a considerable effect on the average particle size of the Ni deposits.

Tài liệu tham khảo

A. Thomas, Nucleonics 13(11), 33–129 (1955) R. G. Lange, W. P. Carroll, Energy Convers. Manag. 49(3), 393–401 (2008) G. Di Bari, in Nickel Plating, Surface Engineering. ASM Handbook, vol. 5 (ASM International, Materials Park, OH, 1994, edited by C. M. Cotell, J. A. Sprague, F. A. Smidt), p. 201 R. Orinakova, A. Turonova, M.G. Kladekova, R.M. Smith, J. Appl. Electrochem. 36(9), 957–972 (2006) C.Q. Cui, J.Y. Lee, Electrochemica Acta 40(11), 1653–1662 (1955) A.M. Rashidi, A. Amadeh, Surf. Coat. Technol. 204(3), 353–358 (2009) G.A. Di Bari, M. Schlesinger, M. Paunovic, Modern Electroplating, 4th edn. (Wiley, New York, 2000), pp. 139–199 D. Landolt, J. Electroanal. Chem. 149(3), S9 (2002) S.C. Tjong, H. Chen, Mater. Sci. Eng. R 45(1–2), 1–88 (2004) F. Ebrahimi, Z. Ahmed, J. Appl. Electrochem. 33(8), 733–739 (2003) S.T. Aruna, S. Diwakar, A. Jain, K.S. Rajam, Surf. Eng. 21(3), 209–214 (2005) G.L. Flx, J.D. Pollack, Anal. Chem. 52(11), 1589–1592 (1980) A.M. El-Sherik, U. Erb, J. Mater. Sci. 30(22), 5743–5749 (1995) Y.R. Uhm, J.H. Park, W.W. Kim, C.-H. Cho, C.K. Rhee, Mater. Sci. Eng. B 106(3), 224–227 (2004) T.C. Franklin, Surf. Coat. Technol. 30(4), 415–428 (1987) G.-Y. Park, Y.R. uhm, S. Choi, D.-Y. Park, J. Kor. Magn. Soc. 23(1), 12–17 (2013) (in Korean) L. Oniciu, L. Muresan, J. Appl. Electrochem. 21(7), 565–574 (1991) Y. Nakamura, N. Kaneko, M. Watanabe, H. Nezu, J. Appl. Electrochem. 24(3), 227–232 (1994)