The chemistry and technology of reworkable polymeric materials for electronic applications
Tóm tắt
As the need to recycle components becomes an ever-pressing issue in our more ‘green’ society, materials must be developed that allow manufacturers to recycle components in a non-destructive manner. Aside from the positive impact on the environment, the economic reasons for replacing defective components or harvesting functional components from obsolete equipment make reworkable materials very attractive. One particular interest with reworkable resins is in the electronics manufacturing sector, where the ability to rework computer components presents an effective solution to replacing defective components on otherwise functional hardware. This review of the current state of affairs of reworkable polymeric materials looks at the various approaches researchers have taken to tackle the reworkable problem, from innovative chip assembly designs to the chemistries used to make potential reworkable adhesives. This review also highlights some of the strengths and weaknesses of each of these approaches. The review also wants to suggest some design guidelines that practitioners of reworkable materials should consider before creating a functional prototype. Finally, the authors would also like to introduce some generic terms that can be used to describe reworkable resins so that researchers can communicate their findings in a more organised and efficient way.
Tài liệu tham khảo
Lau J H,Flip Chip Technologies, McGraw Hill, New York, 1996
Lau J H,Low Cost Flip Chip Technologies for DCA, WLCS, and PBGA Assemblies, McGraw Hill, New York, 2000
Griffith J R,Org Coat Plast,39, 209–11, 1978
Hoffmeyer M K, US Patent 5,757,073, 1998
Layman P L,Chem Eng News,71, 11–14, 1993
Manzione L T,Plastic Packaging of Microelectronic Devices, Van Nostrand Reinhold, New York, 1990
Lau J H,Chip on Board Technologies for Multichip Modules, Van Nostrand Reinhold, New York, 1994
Stevens J J,Epoxy Resin Technology, Interscience Publishers, New York, 1968
Buchwalter S L and L L Kosbar, ‘Cleavable epoxy resins: Design for disassembly or a thermoset’,J Poly Science, Part A: Poly Chem,34, 249–60, 1996
Afzali-Ardakani A, S L Buchwalter, J D Gelorme, L L Kosbar and F L Pompeo, US Patent 5,512,613, 1996
Afzali-Ardakani A, S L Buchwalter, J D Gelorme, L L Kosbar, B H Newman and F L Pompeo, US Patent 5,560,934, 1997
Yang S, J-S Chen, H Körner, T Breiner, C K Ober and M D Poliks, ‘Reworkable epoxies: Thermosets with thermally cleavable groups for controlled network breakdown’,Chem of Mat,10, 1475–82, 1998
Yang S, J-S Chen, H Körner, T Breiner and C K Ober, ‘Design and characterization of a new reworkable epoxy using solvent free thermally induced network breakdown’,Poly Prepr,38, 440–1, 1997
Wang L and C P Wong, ‘Syntheses and characterizations of thermally reworkable epoxy resins. Part 1’,J Poly Science, Part A: Poly Chem,37, 2991–3001, 1999
Wong C P, L Wang and S-H Shi, ‘Novel high performance no flow and reworkable underfills for flipchip’,Mat Res Innovat,2, 232–47, 1999
Iyer S R, S Land, and P K Wong, US Patent 5,726,391, 1998
Iyer S R, S Land and P K Wong, US Patent 5,760,337, 1998
Tesoro G C and V Sastri, ‘Reversible cross-linking in epoxy-resins 1: New approaches’,J Appl Poly Sci,39, 1425–37, 1990
Tesoro G C and V Sastri, ‘Reversible cross-linking in epoxy-resins 2: New approaches’,J Appl Poly Sci,39, 1439–57, 1990
Hall J B, P B Hogerton and J M Pugol, US Patent 5,457,149, 1995
Sachdev K G, M Berger and M S Chace, US Patent 5,700,581, 1997
Grube W and I Y Khandros, US Patent 5,086,558, 1992
Call A J, S L Buchwalter, S Iruvanti, S J Jasne, F L Pompeo, P A Zacco and W M Moreau, US Patent 5,659,203, 1997
Call A J, S L Buchwalter, S Iruvanti, S J Jasne, F L Pompeo, P A Zacco and W M Moreau, US Patent 5,930,597, 1999
Malik J, A Goldslager and S J Clarson, ‘Thermally controlled molecular disassembly of a crosslinked polymer network by the incorporation of sterically hindered urea linkages’,Journal of Applied Polymer Science,85, (4), 856–864, 2002
Velankar S, J Pazos and S L Cooper, ‘High-performance UV-curable urethane acrylates via deblocking chemistry’,J of Appl Poly Sci,62, 1361–476, 1996