The PANDAT software package and its applications

S.-L. Chen1, Scott Daniel1, F. Zhang1, Y. A. Chang2, X.-Y. Yan2, Fanyou Xie2, Rainer Schmid‐Fetzer3, W.A. Oates4
1CompuTherm LLC, 437 S. Yellowstone Drive, Madison, WI 53719, U.S.A.
2Dept. of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706, U.S.A.
3Institute of Metallurgy, University of Clausthal, D-38678 Clausthal-Zellerfeld, Germany
4Science Research Institute, University of Salford, Salford M5 4WT, U.K.

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