The Effect of Hydrogen Peroxide on Composite Lapping of Titanium Alloy (TC4) by Free Abrasive Assisted Fixed Abrasive
Tóm tắt
Từ khóa
Tài liệu tham khảo
C. Veiga, J.P. Devim, A.J.R. Loureiro, Properties and applications of titanium alloys: a brief review. Rev. Adv. Mater. Sci. 32(2), 133–148 (2012)
C. Cui, B. Hu, L. Zhao et al., Titanium alloy production technology market prospects and industry development. Mater. Des. 32(3), 1684–1691 (2011)
D. Yang, Z.Q. Liu, Surface topography analysis and cutting parameters optimization for peripheral milling of titanium alloy Ti-6Al-4V. Int. J. Refract Metal Hard Mater. 51, 192–200 (2015)
S.C. Liao, J. Duffy, Adiabatic shear bands in a TI-6Al-4V titanium alloy. J. Mech. Phys. Solids 46(11), 2201–2231 (1998)
A. Molinari, C. Musquar, G. Sutter, Adiabatic shear banding in high-speed machining of Ti–6A–4V: experiments and modeling. Int. J. Plast. 18(4), 443–459 (2002)
J.H. Xu, Research progress of titanium alloy cutting and grinding technology. Diam. Abras. Eng. 40(05), 1–4 (2020)
P.J. Arrazola, T. Ozel, D. Umbrello et al., Recent advances in modelling of metal machining processes. CIRP Ann. Manuf. Technol. 62(2), 695–718 (2013)
Z.H. Yu, B. Han, S. Chen et al., Process parameters for magnetic abrasive finishing of titanium alloy spatial elbows. Surf. Technol. 47(4), 183–189 (2018)
C.L. Lv, Experimental research on surface roughness of titanium alloy by centrifugal lapping process. Surf. Technol. 45(6), 213–217 (2016)
Y. Niu, F. Jiao, B. Zhao et al., Experiment of machining induced residual stress in longitudinal torsional ultrasonic assisted milling of Ti-6Al-4V. Surf. Technol. 48(10), 41–51 (2019)
M. Wu, L.J. Mm, Z.K. Wang et al., Influence of vibration modes on surface integrity during ultrasonic vibration milling of titanium alloy. J. Vib. Shock 40(4), 164–170 (2021)
T. Vo, T. Buley, J. Gagliardi, Improved planarization for STI with fixed abrasive technology. Solid State Technol. 6, 23–28 (2000)
T.D. Fletcher, F.T. Gobena, V.D. Romero, Diamond fixed abrasive lapping of brittle substrates, in The 18th ASEMEP National Technical Symposium (2004), p. 283–285
J.L. Yuan, Z.W. Wang, D.H. Wen et al., Overview of the status quo of ultra-precision machining. J. Mech. Eng. 43(1), 35–48 (2007)
J. Li, B. Li, Z.G. Hu et al., Optimization of fixed abrasive polishing slurry for LiB3O5 crystal. J. Chin. Ceram. Soc. 41(06), 789–796 (2013)
J.J. Wang, J. Li, J.Y. Huang et al., Process exploration of lapping TC4 Ti alloy with spherical fixed abrasive head. Diam. Abras. Eng. 39(03), 23–28 (2019)
T. Tateishi, Q. Gao, Y. Tani et al., Development of a high-porosity fixed- abrasive pad utilizing catalytic effects of TiO2 on polyurethane matrix. CIRP Ann. Manuf. Technol. 55(1), 321–324 (2006)
J.B. Wang, R. Ma, B.C. Jiang et al., Prediction of subsurface damage for fixed abrasive lapping single crystal sapphire. Surf. Technol. 49(06), 345–351 (2020)
J.L. Yuan, T.J. Zhang, W. Hang et al., Experimental research on high efficiency lapping machining of lithium tantalate based on fixed abrasive pad. Surf. Technol. 48(10), 349–354+371 (2019)
L.M. Nolan, K.C. Cadien, Chemically enhanced synergistic wear: a copper chemical mechanical polishing case study. Wear 307(1–2), 757–777 (2013)
J.P. Chen, Y.W. Zhu, Y.N. Peng et al., Silica-assisted fixed agglomerated diamond abrasive polishing. J. Manuf. Process. 59, 595–660 (2020)
K. Wang, Y.W. Zhu, F.Z. Zheng et al., Study on the lapping of sapphire using fixed abrasive with free silicon carbide particles. J. Synth. Cryst. 44(11), 2937–2942 (2015)
X.X. Tang, Y.W. Zhu, J. Fu et al., Influence of copper content on the machining performance of hydrophilic fixed abrasive pad. Diam. Abras. Eng. 32(4), 10–13 (2012)
C.E. Cui, Q. Miu, J.D. Pan, Measuring of adhesion strength between thin film and substrate. Electron. Process Technol. 05, 294–297 (2005)
J. Du, M.H. Wang, X. Wang, Analysis of influencing factors on critical load of adhesion strength in scratch test. Surf. Technol. 44(09), 134–139 (2015)
J.C. Pan, F.C. Lang, S.Y. Wang et al., Study on micromechanical properties of electron bean photoresist based on nano-scratch technology. Surf. Technol. 50(03), 219–224+260 (2021)
Z.K. Wang, Lapping and Polishing Mechanism of Magnesium Aluminate Spinel Doom Cover by Fixed Abrasive (Nanjing University of Aeronautics and Astronautics, Jiangsu, 2016)
Z.L. Liu, Principles of Tribolog (Higher Education Press, Beijing, 2009), pp.51–54
Y.W. Zhu, X.L. Li, Z.K. Wang et al., Subsurface damage prediction for optical Hard-brittle material in fixed abrasive lapping. Opt. Precis. Eng. 25(02), 367–374 (2017)
S.Y. Chiu, Y.L. Wang, C.P. Liu et al., The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer. Mater. Chem. Phys. 82(2), 444–451 (2003)
Y.J. Dai, H.F. Pei, G.S. Pan et al., Nanoscale planarization mechanism of titanium chemical mechanical polishing. Tribology 31(2), 131–136 (2011)
X.F. Chu, J. Wang, Y.P. Dong et al., Chemical mechanical planarization of ruthenium in hydrogen peroxide-based slurry. Tribology 32(05), 421–427 (2012)
Z.F. Ni, G.M. Chen, L.J. Xu et al., Effect of different oxidizers on chemical mechanical polishing of 6H-SiC. J. Mech. Eng. 54(19), 224–231 (2018)
J.L. Fan, Y.W. Zhu, J. Li et al., Material removal mechanism of K9 glass during chemical mechanical polishing by fixed abrasive pad. Nanotechnol. Precis. Eng. 10(03), 278–283 (2012)
Z.K. Wang, Y.W. Zhu, J.X. Su et al., Effect of acidic slurries on lapping spinel wafer with fixed abrasive pad. J. Synth. Cryst. 45(02), 339–345 (2016)