THE EFFECT OF INDENTER SIZE ON THE DEFORMATION MECHANISM AND DISLOCATION MOTION IN CoCrFeNiCu HEA COATING ON Cu SUBSTRATE USING MOLECULAR DYNAMICS SIMULATION

In this study, we used molecular dynamics (MD) simulations to analyze the deformation behavior of CoCrFeNiCu HEA coatings on Cu substrates, with the radius of the indenter as a simulation variable. Employing dislocation extraction analysis (DXA) and common neighbor analysis (CNA), we evaluated the change in the deformation morphology of atoms subjected to stress shear strain > 0.1. At the same time, the study also predicted the direction of dislocation motion, determined the orientation and shape of the Burgers vector, and the evolution of the dislocation length during the nanoindentation process. The results demonstrate the protective performance of the HEA coating on the Cu substrate and serve as a theoretical basis for applying HEA coatings in manufacturing industries.