Study of the post-etch cleaning compatibility with dense and porous ULK materials – characterization of the process impact

Microelectronic Engineering - Tập 83 - Trang 2319-2323 - 2006
D. Rébiscoul1, B. Puyrenier1, L. Broussous2, D. Louis1, G. Passemard2
1CEA Grenoble-LETI, 17 rue des martyrs, F38054 Grenoble Cedex 9, France
2STMicroelectronics, 850 rue Jean Monnet, F38926 Crolles, France

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