Structural and Magnetic Characterization of the Electrodeposited Cu1−x Co x Thin Films

In this work, Cu1−x Co x thin films with different x values are prepared by the electrodeposition technique. The deposition is carried out in a three-electrode cell using a potentiostat/galvanostat controlled by a computer potentiostatically. Cyclic voltammetry of electrolytes is performed in order to study electroplating process of the films. The films are deposited on Cu substrates in sulfate bath. The effects of different parameters such as bath composition, working electrode’s voltage, addition of sodium saccharin to electrolyte on composition, crystal structure and surface morphology of the films are investigated. The X-ray diffraction patterns reveal that all films have single phase face-centered cubic structures with no extra reflections due to the presence of pure Co or Cu clusters. Addition of sodium saccharin affects morphology of the films by changing the grain size, grain distribution, and grain shape. Magnetic analysis indicates that the saturation magnetization increases as the cobalt percentage increases, while coercivity decreases.