Some recent topics in gold plating for electronics applications

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E. J. Kudrak, J. A. Abys and V. A. Chinchankar, ‘Application of Multiplexing Technology’, (SP-1137), SAE Technical Paper Series 960396, Society of Automotive Engineers, Inc., 1996

Y. Okinaka, in ‘Electroless Plating — Fundamentals and Applications’, ed. G. O. Mallory and J. B. Hajdu, American Electroplaters and Surface Finishers Society, Chapter 15, 1990

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Y. Okinaka and M. Kato, to be published in ‘Modern Electroplating’, ed. M. Schlesinger and M. Paunovic, John Wiley & Sons, New York

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M. Kato, K. Niikura, S. Hoshino and I. Ohno,Hyomen Gijutsu (J. Surface Finish. Soc. Japan), 1991,42, 729

M. Kato, Y. Yazawa and Y. Okinaka, ‘Proceedings of the AESF Technical Conference, SUR/FIN '95’, American Electroplaters and Surface Finishers Society, 1995, pp. 805–813

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M. Kato, Y. Yazawa and S. Hoshino,US Patent 5, 470, 381, 1995

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H. Honma, A. Hasegawa, S. Hotta and K. Hagiwara,Plating and Surface Finish., 1995,82 (4), 89

Y. Nishiwaki, H. Honma, and K. Hagiwara, ‘Proceedings of the 9th JIPC Conference, Japan Institute of Printed Circuits’, 1995, p. 45

G. A. Krulik and N. V. Mandich,US Patent 5, 232, 492, 1993

G. A. Krulik and N. V. Mandich,US Patent 5, 318, 621, 1994

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