Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Research - Tập 2021 - 2021
Kunpeng Ruan1, Yongqiang Guo1, Chuyao Lu2, Xuetao Shi1, Tengbo Ma1, Yali Zhang1, Jie Kong1, Junwei Gu1
1MOE Key Laboratory of Material Physics and Chemistry under Extraordinary Conditions, Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China
2Queen Mary University of London Engineering School, Northwestern Polytechnical University, Xi’an, Shaanxi 710072, China

Tóm tắt

The developing flexible electronic equipment are greatly affected by the rapid accumulation of heat, which is urgent to be solved by thermally conductive polymer composite films. However, the interfacial thermal resistance (ITR) and the phonon scattering at the interfaces are the main bottlenecks limiting the rapid and efficient improvement of thermal conductivity coefficients ( λ ) of the polymer composite films. Moreover, few researches were focused on characterizing ITR and phonon scattering in thermally conductive polymer composite films. In this paper, graphene oxide (GO) was aminated (NH 2 -GO) and reduced (NH 2 -rGO), then NH 2 -rGO/polyimide (NH 2 -rGO/PI) thermally conductive composite films were fabricated. Raman spectroscopy was utilized to innovatively characterize phonon scattering and ITR at the interfaces in NH 2 -rGO/PI thermally conductive composite films, revealing the interfacial thermal conduction mechanism, proving that the amination optimized the interfaces between NH 2 -rGO and PI, reduced phonon scattering and ITR, and ultimately improved the interfacial thermal conduction. The in-plane λ ( λ ∥ ) and through-plane λ ( λ ⊥ ) of 15 wt% NH 2 -rGO/PI thermally conductive composite films at room temperature were, respectively, 7.13 W/mK and 0.74 W/mK, 8.2 times λ ∥ (0.87 W/mK) and 3.5 times λ ⊥ (0.21 W/mK) of pure PI film, also significantly higher than λ ∥ (5.50 W/mK) and λ ⊥ (0.62 W/mK) of 15 wt% rGO/PI thermally conductive composite films. Calculation based on the effective medium theory model proved that ITR was reduced via the amination of rGO. Infrared thermal imaging and finite element simulation showed that NH 2 -rGO/PI thermally conductive composite films obtained excellent heat dissipation and efficient thermal management capabilities on the light-emitting diodes bulbs, 5G high-power chips, and other electronic equipment, which are easy to generate heat severely.

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