Room-temperature deposition of SiNx using ECR-PECVD for semiconductor microelectronics in lift-off technique

Journal of Non-Crystalline Solids - Tập 187 - Trang 334-339 - 1995
A. Wiersch1, C. Heedt1, S. Schneiders1, R. Tilders1, F. Buchali2, W. Kuebart2, W. Prost1, F.J. Tegude1
1Solid State Electronics Department, Sonderforschungsbereich 254, Gerhard-Mercator-University, Kommandantenstr. 60, 47057 Duisburg, Germany
2Alcatel SEL, Stuttgart, Germany

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