Recent developments in advanced polymeric materials for solder mask application: Progress and challenges
Tài liệu tham khảo
Riley, 1988
Sculpher, 1986, Advanced solder masks, Circ. World, 12, 9, 10.1108/eb043813
2022
Walter, 2013, Evaluation of solder resists for Module integration of MWT solar cells, Energy Proc., 38, 395, 10.1016/j.egypro.2013.07.295
Sperança, 2018, Determination of elemental content in solder mask samples used in printed circuit boards using different spectroanalytical techniques, Appl. Spectrosc., 72, 1205, 10.1177/0003702818774580
Son, 2018, Mechanical property and plated solder volume effect of Cu core ball, 137
Serenson, 1999, Effect of solder mask and surface mount adhesive types on a PCB manufacturing process, 731
Chen, 2007, Solder joint reliability assessment for flip chip ball grid array components with various designs in lead-free solder materials and solder mask dimensions, J. Electron. Mater., 36, 6, 10.1007/s11664-006-0026-z
Chowdhury, 2018, Mechanical characterization of solder mask materials, 1133
Kozak, 2023, Analysis of solder mask roughness and stencil shape influence on void formation in solder joints, Weld. World, 10.1007/s40194-023-01505-7
Veselý, 2020, Analysis of No-clean flux spatter during the soldering process, J. Mater. Process. Technol., 275
Piotrowska, 2018, Effect of solder mask surface chemistry and Morphology on the water layer formation under humid conditions, IEEE Trans. Compon. Packag. Manuf. Technol., 8, 1756, 10.1109/TCPMT.2018.2792047
Barbucha, 2016, Recent progress in direct exposure of interconnects on PCBs, Circ. World, 42, 42, 10.1108/CW-10-2015-0050
Piotrowska, 2015, Contamination, potential bias and humidity effects on electrical performance and corrosion reliability of electronic devices
Nagoshi, 2011, New trend and application of photosensitive solder resist for semiconductor package, Nippon Gomu Kyokaishi (J. Jpn. Rubber Assoc., 84, 306, 10.2324/gomu.84.306
Shiina, 2016, Reliability improvement of solder resist for semiconductor package substrate, 174
Wakeel, 2021, Constituents and performance of No-clean flux for electronic solder, Microelectron. Reliab., 123
Ueta, 2017, Development of solder resist with improved adhesion at HTSL (175 deg C for 3000 hours) and crack resistance at TST for automotive IC package, 156
Shimada, 2019, High reliability solder resist with strong adhesion and high resolution for high density packaging, 1015
Inagaki, 2018, The modern technology trend of solder resist and interlayer insulating material for printed circuit boards, J. Electron. Packag. Soc. Japan, 21, 202
Kaya, 2019
Yang, 2013, Synthesis of low viscosity, fast UV curing solder resist based on epoxy resin for ink-jet printing, J. Appl. Polym. Sci., 129, 187, 10.1002/app.38738
Lea, 1988, The effect of solder mask on PCB solderability, Circ. World, 15, 12, 10.1108/eb046049
Decker, 2005, New developments in UV radiation curing of protective coatings, Surf. Coating. Int. B Coating. Trans., 88, 9, 10.1007/BF02699702
Kitano, 2012, Free radical shadow cure initiated using two-component and three-component initiator systems, Int. J. Photoenergy, 10.1155/2012/213846
Itokawa, 2006, Radiation Curing Technology in Liquid Photo-Imageable Solder Mask (LPISM)
Kramer, 2018, Thermal capabilities of solder masks and other coating materials – how high can we go?
Arima, 2010, Solder resist for next-generation electric circuit board, J. Electron. Packag. Soc., 13, 396
Chol, 2007, Resolution and adhesion properties of solder resist for printed circuit board, Korean J. Mater. Res., 17, 676
Huh, 2015, Chlorine effect on ion migration for PCBs under temperature-humidity bias test, J. Weld. Join., 33, 47
Lee, 2020, Improvement of PCB reliability under HAST conditions by enhancing adhesion of DFSR on PPG, 53
Okada, 2015, Development of photosensitive solder resist with high reliability for semiconductor package, vol. 28, 367
Muniandy, 2018, Solder resist crack resistance process characterization in BGA package for automotive grade reliability, 120
Dias, 2019, Challenges and approaches to developing automotive grade 1/0 FCBGA package capability, 163
Ume, 1997, Finite element analysis of PWB warpage due to solder masking process, vol. 20, 295
Fahim, 2020, Nanomechanical characterization of various materials within PBGA packages subjected to thermal cycling loading, 1302
He, 2010, Effects of solder mask on electrochemical migration of tin-lead and lead-free boards
Lee, 2013, Electrochemical reactions in solder mask of flip chip-plastic ball grid array package, 2138
Chien, 2004, Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling, Exp. Mech., 44, 214, 10.1007/BF02428181
Inagaki, 2006, Composition of photo-imageable solder resist mask and demand properties, Nippon Gomu Kyokaishi (J. Jpn. Rubber Assoc.), 79, 406, 10.2324/gomu.79.406
Yang, 2015, Preparation and characterization of printable solder resist inks based on hyperbranched polyester, J. Appl. Polym. Sci., 132, 1, 10.1002/app.41805
Matsumura, 2009, Development of liquid solder resist based on polyimide, J. Photopolym. Sci. Technol., 22, 437, 10.2494/photopolymer.22.437
Sun, 2010, Study on properties of a novel photosensitive polysiloxane urethane acrylate for solder mask, J. Appl. Polym. Sci., 116, 3035, 10.1002/app.31847
Li, 2013, Synthesis and property of water-soluble hyperbranched photosensitive polysiloxane urethane acrylate, Ind. Eng. Chem. Res., 52, 2220, 10.1021/ie303084w
Liang, 2019, Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink-jet printing, J. Appl. Polym. Sci., 136, 1, 10.1002/app.47428
Naiki, 2007, Flame retardant polyimidepolysiloxane-based solder resist, J. Photopolym. Sci. Technol., 20, 149, 10.2494/photopolymer.20.149
Wang, 2019, Study on alkali-soluble epoxy acrylates resin modified by glycidyl ester of versatic acid, Imaging Sci. Photochem., 37, 185
Hofmeister, 2017, Evaluation of process influences on surface chemistry of epoxy acrylate based solder mask via XPS, ToF-SIMS and contact angle Measurement, Mater. Chem. Phys., 185, 129, 10.1016/j.matchemphys.2016.10.015
Inagaki, 2016, Preparation and property evaluations of liquid non-solvent solder resists which can Be developed with alkaline solution, J. Japan Inst. Electron. Packag., 19, 189, 10.5104/jiep.19.189
Jeng, 2007, Photosensitive polyimide for coverlay of flexible printed circuit, 369
Zhu, 2000, Micro-mechanical characterizations of solder mask materials, 148
Xu, 2021, Recent development of polyimides: synthesis, processing, and application in gas separation, J. Polym. Sci., 59, 943
Sukanto, 2021, Epoxy resins thermosetting for mechanical engineering, Open Eng., 11, 797, 10.1515/eng-2021-0078
Hofmeister, 2015, Influence of copper layer on epoxy acrylate based solder mask surface chemistry and the effect on epoxy adhesion, Appl. Adhes. Sci., 3, 1, 10.1186/s40563-015-0040-6
Yoshino, 2008, Photo imageable solder resist for semiconductor packages, 1995
Paczkowski, 1993, Solder mask strategies for surface mount assembly, Solder. Surf. Mt. Technol., 5, 12, 10.1108/eb037822
Madou, 2011
Walwadkar, 2016, Influence of PCB surface features on BGA assembly yield, 25
Mendes-Felipe, 2019, State-of-the-Art and future challenges of UV curable polymer-based smart materials for printing technologies, Adv. Mater. Technol., 4, 1, 10.1002/admt.201800618
Siau, 2005, Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes, Appl. Surf. Sci., 245, 353, 10.1016/j.apsusc.2004.10.058
Novik, 2020, Testing and implementation of direct imaging and direct jetting of solder mask
Omer, 2002, An introduction to laser direct imaging for high density interconnects, Circ. World, 29, 32, 10.1108/03056120310444160
Yue, 2013, Screen printing of solder resist as master substrates for fabrication of multi-level microfluidic channels and flask-shaped microstructures for cell-based applications, Biosens. Bioelectron., 41, 675, 10.1016/j.bios.2012.09.046
Roy, 2007, Fabrication of micro- and nano-structured materials using mask-less processes, J. Phys. D Appl. Phys., 40, R413, 10.1088/0022-3727/40/22/R02
Wagner, 2019, Photoinitiator-free photopolymerization of acrylate-bismaleimide mixtures and their application for inkjet printing, J. Appl. Polym. Sci., 136, 1, 10.1002/app.47789
Albin, 2003, Soldermask laser direct imaging – an enabling technology, Circ. World, 29, 10, 10.1108/03056120310460757
Xu, 2013, Printed electronics based on precision coating, Appl. Mech. Mater., 312, 550, 10.4028/www.scientific.net/AMM.312.550
Sutter, 2005, An overview of digital printing for advanced interconnect applications, Circ. World, 31, 4, 10.1108/03056120510585009
Phung, 2021, IoT device fabrication using roll-to-roll printing process, Sci. Rep., 11, 1, 10.1038/s41598-021-99436-0
Wallace, 2012, Overview of inkjet-based Micromanufacturing, 1
Bejarano, 2009, Screen printing as a holistic manufacturing method for multifunctional microsystems and microreactors, J. Micromech. Microeng., 19, 10.1088/0960-1317/19/11/115007
Milgrom, 2009, Evolving into the age of digital ink jet solder mask printing, 89
Zohar, 2005, 8
Derby, 2010, Inkjet printing of functional and structural materials: fluid property requirements, feature stability, and resolution, Annu. Rev. Mater. Res., 40, 395, 10.1146/annurev-matsci-070909-104502
Tilsley, 1987, Comparison of dry film and liquid photo-Imageable solder masks for surface-mount assemblies, Circ. World, 14, 5, 10.1108/eb043929
Fu, 2009, Film type solder mask evaluation for flip chip BGA, 121
Yang, 2019, Fabrication of UV-curable solvent-free epoxy modified silicone resin coating with high transparency and low volume shrinkage, Prog. Org. Coating, 129, 96, 10.1016/j.porgcoat.2019.01.005
Chen, 2019, UV and thermal cure epoxy adhesives, 71
Ingrosso, 2015, UV-curable nanocomposite based on Methacrylic-siloxane resin and surface-modified TiO2 nanocrystals, ACS Appl. Mater. Interfaces, 7, 15494, 10.1021/acsami.5b03731
Yu, 2017, Three-dimensional printing of shape memory composites with epoxy-acrylate hybrid photopolymer, ACS Appl. Mater. Interfaces, 9, 1820, 10.1021/acsami.6b13531
Zhou, 2019, Progress in the development of polymeric and multifunctional photoinitiators, Prog. Polym. Sci., 99, 10.1016/j.progpolymsci.2019.101165
Chen, 2017, High performance UV and thermal cure hybrid epoxy adhesive, vol. 213
Bednarczyk, 2021, Photocurable epoxy acrylate coatings preparation by dual cationic and radical photocrosslinking, Materials, 14, 4150, 10.3390/ma14154150
Zhao, 2018, Silicone–epoxy-based hybrid photopolymers for 3D printing, Macromol. Chem. Phys., 219, 10.1002/macp.201700530
Ravve, 2006, Photosensitizers and photoinitiators, 23
Zhu, 2018, Fabrication of high-performance cationic UV curable cycloaliphatic epoxy/silicone hybrid coatings, Macromol. Mater. Eng., 303, 10.1002/mame.201800020
Jiang, 2022, Recent advances in UV/thermal curing silicone polymers, Chem. Eng. J., 435, 10.1016/j.cej.2022.134843
Schissel, 2019, Controlling shadow cure in cationic photopolymerizations using physical cues and processing variables, J. Appl. Polym. Sci., 137, 1
Cho, 2005, Photo-curing kinetics for the UV-initiated cationic polymerization of a cycloaliphatic diepoxide system photosensitized by thioxanthone, Eur. Polym. J., 41, 367, 10.1016/j.eurpolymj.2004.10.006
Park, 2009, UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers, Int. J. Adhesion Adhes., 29, 710, 10.1016/j.ijadhadh.2009.02.001
Qin, 2012, Influence of thickness of interfacial IMC layer and solder mask layer on mechanical reliability of micro-scale BGA structure interconnects, 714
Ishikawa, 2014, Photo sensitive solder resist containing high γ-relaxation unit to high resistance at thermal shock test and insulation reliability, J. Electron. Packag. Soc., 17, 74
Coppola, 2008, Investigation on current density limits in power printed circuit boards, 205
Chen, 2020, Direct multi-field coupling methodology for modeling moisture-induced stresses and delamination in electronic packages, 1064
Nichols, 2020, Lead-free printed wiring board surface finishes, 249
Yeung, 2004, Bias-HAST on tape ball grid array (TBGA) test pattern, Microelectron. Reliab., 44, 595, 10.1016/j.microrel.2003.08.008
Baszyński, 2018, Experimental studies of: laminate composition, drill bit wear out, and chloride ion concentration as factors affecting CAF formation rate, Microelectron. Reliab., 88–90, 31, 10.1016/j.microrel.2018.06.086
Pahl, 2004, Long time reliability study of soldered flip chips on flexible substrates, Microelectron. Reliab., 44, 309, 10.1016/j.microrel.2003.10.006
Siau, 2006, Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers, Appl. Surf. Sci., 252, 2717, 10.1016/j.apsusc.2005.04.027
Akbari, 2018, Predicting delamination in multilayer composite circuit boards with bonded microelectronic components, Eng. Fract. Mech., 187, 225, 10.1016/j.engfracmech.2017.11.026
Cheng, 2017, A review of lead-free solders for electronics applications, Microelectron. Reliab., 75, 77, 10.1016/j.microrel.2017.06.016
Saeki, 2004, Next generation organic solderability preservatives (OSP) for lead-free soldering and mixed metal finish PWB's and BGA substrates
Huang, 2011, The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction, Solder. Surf. Mt. Technol., 23, 211, 10.1108/09540911111169057
Ratzker, 2014, Review of capabilities of the ENEPIG surface finish, J. Electron. Mater., 43, 3885, 10.1007/s11664-014-3322-z
Lee, 2018, Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder, Microelectron. Reliab., 87, 75, 10.1016/j.microrel.2018.05.017
Shamkhalichenar, 2020, Printed circuit board (PCB) technology for electrochemical sensors and sensing platforms, Biosensors, 10, 159, 10.3390/bios10110159
Pauls, 2001, Residues in printed wiring boards and assemblies, Circ. World, 27, 32, 10.1108/03056120110360291
Goodman, 2006
Sweatman, 2009, Hot air solder leveling in the lead-free era, 10
Tong, 2013, The Evolution of Organic Solderability Preservative (OSP) Process in PCB Application, 43
Carano, 2011, The evolution of organic solderability preservatives (OSPs) from a temporary protectant to a leadership position in surface finishing chemistry, Circ. World, 37, 12, 10.1108/03056121111128279
Kim, 2008, Origin of surface defects in PCB final finishes by the electroless nickel immersion gold process, J. Electron. Mater., 37, 527, 10.1007/s11664-007-0360-9
Lee, 2018, Investigation of surface defects of electroless Ni plating by solder resist dissolution on the ENIG process, Microelectron. Eng., 200, 39, 10.1016/j.mee.2018.06.001
Nichols, 2017, Soldering immersion tin
Songhua, 2021, Fundamentals of advanced materials and processes in organic substrate technology, 397
Hong, 2012, Process optimization for flexible printed circuit board assembly manufacturing, Trans. Electr. Electron. Mater., 13, 129, 10.4313/TEEM.2012.13.3.129
Golding, 1995, PCB assembly, Assemb. Autom., 15, 10, 10.1108/01445159510086399
Lau, 2016, Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review, Solder. Surf. Mt. Technol., 28, 41, 10.1108/SSMT-10-2015-0032
Conseil, 2014, Contamination profile on typical printed circuit board assemblies vs soldering process, Solder. Surf. Mt. Technol., 26, 194, 10.1108/SSMT-03-2014-0007
Chiou, 2011, Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth, Microelectron. Reliab., 51, 2319, 10.1016/j.microrel.2011.06.025
Andersson, 2009, Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages, Solder. Surf. Mt. Technol., 21, 28, 10.1108/09540910910947453
Xu, 2021, Research progress in modification of epoxy resins with hyperbranched polyesters, China Plast, 35, 110
Khalina, 2019, The effect of reactive diluent on mechanical properties and microstructure of epoxy resins, Polym. Bull., 76, 3905, 10.1007/s00289-018-2577-6
Komuro, 2017, Development of next generation solder resist, 71
Ishikawa, 2014, Solder resist containing polyurethane binder having terminal carboxyl groups to improvement of high resistance at thermal cycle test (TCT), J. Electron. Packag. Soc., 17, 69
International
Bauer, 2014, Photoinitiator-free UV curing and matting of acrylate-based nanocomposite coatings: Part 3, Prog. Org. Coating, 77, 1085, 10.1016/j.porgcoat.2014.03.013
Vázquez, 2009, Photopolymerization without photoinitiator of bismaleimide-containing oligo(oxypropylene)s: effect of oligoethers chain length, Macromol. Chem. Phys., 210, 269, 10.1002/macp.200800510
Daikos, 2016, Peculiarities of the photoinitiator-free photopolymerization of pentabrominated and pentafluorinated aromatic acrylates and methacrylates, Phys. Chem. Chem. Phys., 18, 32369, 10.1039/C6CP06549J
2010