Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal

Springer Science and Business Media LLC - Tập 20 Số 3 - Trang 199-206 - 1999
Kenichi Ohsasa1, Toshio Narita1, Toshiyasu Shinmura2
1Division of Molecular Chemistry, Graduate School of Engineering, Hokkaido University, Sapporo, Japan
2Hokkaido University Hitachi Ltd., Hitachi City, Japan

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