Nanoelectronic COupled problems solutions - nanoCOPS: modelling, multirate, model order reduction, uncertainty quantification, fast fault simulation

E.J.W. ter Maten1, Piotr Putek1, Michael Günther1, Roland Pulch2, Caren Tischendorf3, Christian Strohm3, Wim Schoenmaker4, Peter Meuris4, Bart De Smedt4, Peter Benner5, Lihong Feng5, Nicodemus Banagaaya5, Yao Ya5, Ruud Janssen6, Jos J. Dohmen6, B. Tasić6, Frederik Deleu7, Renaud Gillon7, Aarnout Wieers7, Hans Georg Brachtendorf8, Kai Bittner8, Tomas Kron9, Jiří Petřzela9, Roman Šotner9, Tomáš Götthans9, J. Dřínovský9, Sebastian Schöps10, David J. Duque Guerra10, Thorben Casper10, Herbert De Gersem10, Ulrich Römer10, Pascal Reynier11, Patrice Barroul11, Denis Masliah11, Benoı̂t Rousseau11
1Bergische Universität Wuppertal, Gauß-Straße 20, Wuppertal, 42119, Germany
2Ernst-Moritz-Arndt-Universität Greifswald, Walther-Rathenau-Straße 47, Greifswald, 17487, Germany
3Humboldt Universität zu Berlin, Unter den Linden 6, Berlin, 10099, Germany
4MAGWEL NV, Vital Decosterstraat 44 bus 27, Leuven, 3000, Belgium
5Max Planck Institut für Dynamik komplexer technischer Systeme, Sandtorstr. 1, Magdeburg, 39106, Germany
6NXP Semiconductors, High Tech Campus 46, Eindhoven, 5656 AE, The Netherlands
7ON Semiconductor Belgium BVBA, Westerring 15, Oudenaarde, 9700, Belgium
8Fachhochschule Oberösterreich, Softwarepark 11, Hagenberg im Mühlkreis, 4232, Austria
9Vysoké uc̆ení technické v Brnĕ, Brno University of Technology, Purkyňova 464/118, Královo Pole, Brno, 61200, Czech Republic
10Technische Universität Darmstadt, Dolivostraße 15 & Schloßgartenstraße 8, Darmstadt, 64293, Germany
11ACCO Semiconductor, 36-38 Rue de la Princesse, Louveciennes, 78430, France

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Janssen HHJM, Benner P, Bittner K, Brachtendorf H-G, Feng L, ter Maten EJW, Schöps S, Tischendorf C. The European project nanoCOPS for nanoelectronic coupled problems solutions. In: Russo G, Capasso V, Nicosia G, Romano V, editors. Progress in industrial mathematics at ECMI 2014. Mathematics in industry. vol. 22. Berlin: Springer; 2016.

Janssen R, ter Maten J, Tischendorf C, Brachtendorf H-G, Bittner K, Schoenmaker W, Benner P, Feng L, Pulch R, Deleu F, Wieers A. The nanoCOPS project on algorithms for nanoelectronic coupled problems solutions. In: Schreffler B, Oñate E, Papadrakakis M, editors. Coupled problems in science and engineering VI - COUPLED PROBLEMS 2015. Barcelona: CIMNE - International Center for Numerical Methods in Engineering; 2015. p. 1029-36. ISBN 978-84-943928-3-2.

Banagaaya N, Feng L, Schoenmaker W, Meuris P, Wieers A, Gillon R, Benner P. Model order reduction for nanoelectronics coupled problems with many inputs. In: Proceedings of design, automation and test in Europe (DATE). 2016. p. 313-8. Paper 0996.

Casper T, De Gersem H, Gotthans T, Schoenmaker W, Schöps S, Wieers A. Electrothermal simulation of bonding wire degradation under uncertain geometries. In: Proceedings of design, automation and test in Europe (DATE). 2016. p. 1297-302. Paper 0776.

Putek P, Meuris P, Pulch R, ter Maten EJW, Günther M, Schoenmaker W, Deleu F, Wieers A. Shape optimization of a power MOS device under uncertainties. In: Proceedings of design, automation and test in Europe (DATE). 2016. p. 319-24. Paper 0998.

Schoenmaker W, Meuris P, Strohm C, Tischendorf C. Holistic coupled field and circuit simulation. In: Proceedings of design, automation and test in Europe (DATE). 2016. p. 307-12. Paper 0995.

Tasić B, Dohmen JJ, Janssen R, ter Maten EJW, Beelen TGJ, Pulch R. Fast time-domain simulation for reliable fault detection. In: Proceedings of design, automation and test in Europe (DATE). 2016. p. 301-6. Paper 0994.

Duque Guerra DJ, Schöps S. A fractional step method for the dynamic electro-thermal modelling of device structures. IFAC-PapersOnLine. 2015;48(1):932-3.

Kaufmann C, Günther M, Klagges D, Knorrenschild M, Richwin M, Schöps S, ter Maten EJW. Efficient frequency-transient co-simulation of coupled heat-electromagnetic problems. J Math Ind. 2014;4:1.

Schoenmaker W, Dupuis O, De Smedt B, Meuris P. Fully-coupled electro-thermal power device fields. In: Russo G, Capasso V, Nicosia G, Romano V, editors. Progress in industrial mathematics at ECMI 2014. Mathematics in industry. vol. 22. Berlin: Springer; 2016.

Baumanns S, Jansen L, Selva-Soto M, Tischendorf C. Analysis of semi-discretized differential algebraic equation from coupled circuit device simulation. Comput Appl Math. 2015;34(3):933-55.

Strohm C, Tischendorf C. Interface model integrating full-wave Maxwell simulation models into modified nodal equations for circuit simulation. IFAC-PapersOnLine. 2015;48(1):940-1.

Duque D, Schöps S, De Gersem H, Wieers A. nanoCOPS: analytical approach for estimating the heating of bond-wires. ECMI Newsletter. 2014;56:70-1. http://www.mafy.lut.fi/EcmiNL/issues.php?action=viewar&ID=353 .

Nöbauer GT, Mose H. Analytical approach to temperature evaluation in bonding wires and calculation of allowable current. IEEE Trans Adv Packaging. 2000;23(3):426-35.

Duque D, Schöps S, Wieers A. An extended analytical approach for the estimation of the heating of bond-wires. In: Russo G, Capasso V, Nicosia G, Romano V, editors. Progress in industrial mathematics at ECMI 2014. Mathematics in industry. vol. 22. Berlin: Springer; 2016.

Petrzela J, Sotner R, Gotthans T, Drinovsky J, Kratochvil T, Wieers A, Gillon R. Different DC fusing scenarios of encapsulated bonding wires. Accepted for presentation at SCEE-2016, Scientific Computing in Electrical Engineering, St. Wolfgang / Strobl, Austria.

Günther M, editor. Coupled multiscale simulation and optimization in nanoelectronics. Mathematics in industry. vol. 21. Berlin: Springer; 2015.

Bittner K, Brachtendorf H-G. Fast algorithms for adaptive free knot spline approximation using nonuniform biorthogonal spline wavelets. SIAM J Sci Comput. 2015;37(2):B283-B304.

Banagaaya N, Feng L, Meuris P, Schoenmaker W, Benner P. Model order reduction of an electro-thermal package model. IFAC-PapersOnLine. 2015;48(1):934-5.

Benner P, Feng L. Model order reduction for coupled problems. Appl Comput Math Int J. 2015;14(1):3-22.

Yue Y, Feng L, Meuris P, Schoenmaker W, Benner P. Application of Krylov-type parametric model order reduction in efficient uncertainty quantification of electro-thermal circuit. In: Proceedings PIERS. 2015. p. 379-84.

Feng L, Meuris P, Schoenmaker W, Benner P. Parametric and reduced-oder modeling for the thermal analysis of nanoelectronic structures. In: Bartel A, Clemens M, Günther M, ter Maten EJW, editors. Scientific computing in electrical engineering SCEE-2014, Wuppertal, Germany. Mathematics in industry. vol. 23. Berlin: Springer; 2016. p. 155-63.

Benner P, Feng L. A robust algorithm for parametric model order reduction based on implicit moment matching. In: Quarteroni A, Rozza G, editors. Reduced order methods for modeling and computational reduction. Springer MS&A series. vol. 9. Cham: Springer; 2014. p. 159-85.

Xiu D. Numerical methods for stochastic computations - a spectral method approach. Princeton: Princeton University Press; 2010.

Putek P, Meuris P, Pulch R, ter Maten EJW, Schoenmaker W, Günther M. Uncertainty quantification for robust topology optimization of power transistor devices. IEEE Trans Magn. 2016;52(3):1700104.

Dakota 6.3 - Algorithms for design exploration and simulation. Albuquerque, NM, USA: Sandia National Laboratories; 2015. https://dakota.sandia.gov/ .

Le Maître OP, Knio OM. Spectral methods for uncertainty quantification. With applications to computational fluid dynamics. Dordrecht: Springer; 2010.

Pulch R, ter Maten EJW, Augustin F. Sensitivity analysis and model order reduction for random linear dynamical systems. Math Comput Simul. 2015;111:80-95.

Zhang H, Chen T-H, Ting M-Y, Li X. Efficient design-specific worst-case corner extraction for integrated circuits. In: IEEE design automation conference (DAC). 2009. p. 386-9.

Tasić B, Dohmen JJ, ter Maten EJW, Beelen TGJ, Schilders WHA, de Vries A, van Beurden M. Robust DC and efficient time-domain fast fault simulation. Compel. 2014;33(4):1161-74.