Monitoring of Epoxy Curing by a Thermal-Conductivity Sensor Based on the Hot-Ball Transient Method

International Journal of Thermophysics - Tập 33 Số 7 - Trang 1164-1176 - 2012
Ľ. Kubičár1, Carlos Calvo Anibarro1, Viliam Vretenár1, Peter Dieška2, Igor Novák3, Ivan Chodák3
1Institute of Physics, Slovak Academy of Sciences, Bratislava, Slovakia
2Faculty of Electrical Engineering and Information Technology, Slovak University of Technology, Bratislava, Slovakia
3Polymer Institute, Slovak Academy of Sciences, Bratislava, Slovakia

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