Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy
Tài liệu tham khảo
Braga, 2007, The experimental study of the Bi–Sn, Bi–Zn and Bi–Sn–Zn systems, CALPHAD, 31, 468, 10.1016/j.calphad.2007.04.004
Shalaby, 2013, Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys, Mater. Sci. Eng. A, 560, 86, 10.1016/j.msea.2012.09.038
Goh, 2013, Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder, Electrochim. Acta, 90, 265, 10.1016/j.electacta.2012.12.036
Vianco, 2004, Development of Sn-based, low melting temperature Pb-free solder alloys, Mater. Trans., 45, 765, 10.2320/matertrans.45.765
Dai, 2011, One-step fabrication of Al/Sn–Bi core-shell spheres via phase separation, J. Electron. Mater., 40, 2458, 10.1007/s11664-011-1779-6
Mei, 1992, Characterization of eutectic Sn–Bi solder joints, J. Electron. Mater., 21, 599, 10.1007/BF02655427
Goldstein, 1994, Microstructural development of eutectic Bi–Sn and eutectic In–Sn during high temperature deformation, J. Electron. Mater., 23, 477, 10.1007/BF02671233
Mostofizadeh, 2012, Reliability and microstructural evolution of Sn-Bi-Ag solder paste during salt spray test, Carts International, 2163
Chuang, 2011, Effects of Ce addition on the microstructure and mechanical properties of Sn–58Bi solder joints, J. Electron. Mater., 40, 71, 10.1007/s11664-010-1385-z
Xiaowu, 2012, Research on lamellar structure and micro-hardness of directionally solidified Sn–58Bi eutectic alloy, Chin. foundry, 9, 360
Glazer, 1995, Metallurgy of low temperature Pb-free solders for electronic assembly, Int. Mater. Rev., 40, 65, 10.1179/imr.1995.40.2.65
Hua, 1998, Eutectic Sn-Bi as an Alternative to Pb-Free Solders. Production Generation Solution – Technology Center Hewlett Packard Company, 277
Wood, 1994, In search of new lead-free electronic solders, J. Electron. Mater., 23, 709, 10.1007/BF02651363
Li, 2006, Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects, Acta Mater., 54, 2907, 10.1016/j.actamat.2006.02.030
Yoon, 2002, Interfacial reactions between Sn-58%mass Bi eutectic solder and (Cu, electroless Ni–P/Cu) substrate, Mater. Trans. A, 43, 712
Moon, 2001, The effect of Pb contamination on the solidification behavior of Sn–Bi solders, J. Electron. Mater., 30, 45, 10.1007/s11664-001-0213-x
Liu, 2005, The Evaluation of Sn-58Bi Composite Solder Mixed with Y2O3, 1
Torres, 2012, Effect of antimony additions on corrosion and mechanical properties of Sn–Bi eutectic lead-free solder alloy, Mater. Sci. Appl., 3, 355
Shen, 2012, Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation, Mater. Sci. Eng. A, 558, 253, 10.1016/j.msea.2012.07.120
Fang-qiu, 2007, Effect of liquid–liquid structure transition on solidification of Sn–Bi alloys, Trans. Nonferrous Met. Soc., 17, 893, 10.1016/S1003-6326(07)60195-2
Osório, 2013, Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys, J. Alloys Compd., 572, 97, 10.1016/j.jallcom.2013.03.234
Frongia, 2015, Synthesis and melting behaviour of Bi, Sn and Sn–Bi nanostructured Alloy, J. Alloys Compd., 623, 7, 10.1016/j.jallcom.2014.08.122
Croker, 1973, The characterization of eutectic structures, Proc. R. Soc., A335, 15, 10.1098/rspa.1973.0111
McCormack, 1997, Significantly improved of Bi–Sn solder alloys mechanical properties by Ag-doping, J. Electron. Mater., 26, 954, 10.1007/s11664-997-0281-7
Canté, 2008, Microstructural development in Al–Ni alloys directionally solidified under unsteady-state conditions, Metall. Mater. Trans. A, 39, 1712, 10.1007/s11661-008-9536-z
Goulart, 2009, Cellular growth during transient directional solidification of hypoeutectic Al–Fe alloys, J. Alloys Compd., 470, 589, 10.1016/j.jallcom.2008.03.026
Rosa, 2008, Cellular/dendritic transition and microstructure evolution during transient directional solidification of Pb–Sb alloys, Metall. Mater. Trans. A, 39A, 2161, 10.1007/s11661-008-9542-1
Gunduz, 2002, Directional solidification of aluminium–copper alloys, Mater. Sci. Eng. A, 327, 167, 10.1016/S0921-5093(01)01649-5
Kurz, 1992
Vianco, 1999, Properties of ternary Sn–Ag–Bi solder alloys: part I — thermal properties and microstructural analysis, J. Electron. Mater., 28, 1127, 10.1007/s11664-999-0250-4
Gupta, 2003
Chadwick, 1963, Eutectic alloy solidification, Prog. Mater. Sci., 12, 99, 10.1016/0079-6425(63)90037-9
Garcia, 2010, Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure arrays, Mater. Charact., 61, 212, 10.1016/j.matchar.2009.11.012
Spinelli, 2014, Assessment of tertiary dendritic growth and its effects on mechanical properties of directionally solidified Sn–0.7Cu–xAg solder alloys, J. Electron. Mater., 43, 1347, 10.1007/s11664-014-3087-4
Jackson, 1966, Lamellar and rod eutectic growth, Trans. Metall. Soc. AIME, 236, 1129
Garcia, 1978, Mathematical model for the unidirectional solidification of metals: 1. Cooled molds, Metall. Trans. B, 9, 449, 10.1007/BF02654420
Garcia, 1979, Mathematical model for the unidirectional solidification of metals: 2. Massive molds, Metall. Trans. B, 10, 85, 10.1007/BF02653977
Feurer, 1977, 131
Mortensen, 1991, On the rate of dendrite arm coarsening, Metall. Trans. A, 22, 569, 10.1007/BF02656824
Bouchard, 1997, Prediction of dendrite arm spacings in unsteady and steady state heat flow of unidirectionally solidified binary alloys, Metall. Mater. Trans. B, 28, 651, 10.1007/s11663-997-0039-x
Siewert, 2002, Database for solder properties with emphasis on new lead-free solder
Hu, 2015, Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification, J. Alloys Compd., 625, 241, 10.1016/j.jallcom.2014.10.205