Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Materials Characterization - Tập 107 - Trang 43-53 - 2015
Bismarck Luiz Silva1, Guillaume Reinhart2, Henri Nguyen-Thi2, Nathalie Mangelinck-Noël2, Amauri Garcia3, José Eduardo Spinelli1
1Department of Materials Engineering, Federal University of São Carlos UFSCar, 13565-905 São Carlos, SP, Brazil
2Aix Marseille Université, CNRS, IM2NP UMR 7334, 13397, Marseille, France
3Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, PO Box 6122, 13083-970 Campinas, SP, Brazil

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