Micro-scratch inspection system for semiconductor process by two-ways laser scattering method
Proceedings of the 4th World Congress on Intelligent Control and Automation (Cat. No.02EX527) - Tập 3 - Trang 2150-2153 vol.3
Tóm tắt
CMP (Chemical Mechanical Polishing) is a key technology in semiconductor processing. However, when a problem arises in the polishing conditions, scratches are caused and yield can deteriorate drastically. We study the characteristic figure of scratch the depth of which is extremely shallow compared with width. We propose a 2-way illumination comparative discrimination method. By experiment, we obtain a good discrimination ratio between scratch and particle on unpatterned dummy wafers.
Từ khóa
#Inspection #Semiconductor lasers #Chemical technology #Wiring #Chemical lasers #Particle scattering #Semiconductor films #Production engineering #Chemical processes #LightingTài liệu tham khảo
10.1002/andp.19083300302
10.1109/ISSM.1999.808757
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witt, 1997, A post-oxide CMP cleaning method based up on APM chemistries, Proc CMP-MIC, 351