Methods for Detection of Subsurface Damage: A Review
Tóm tắt
Từ khóa
Tài liệu tham khảo
S Gao. Fundamental research on silicon wafer thinning by ultra-precision grinding. Dalian University of Technology, 2013. (in Chinese)
Y X Zhang. Study on the surface layer damage of monocyrstalline silicon wafer induced by ultra-precision grinding. Dalian University of Technology, 2006. (in Chinese)
Z J Pei. A study on surface grinding of 300 mm silicon wafers. International Journal of Machine Tools and Manufacture, 2002, 42(3): 385–393.
R K Kang, Y X Zhang, D M Guo, et al. Study on the Surface and Subsurface Integrity of Ground Monocrystalline Silicon Wafers. Key Engineering Materials, 2005, 291–292: 425–432.
J M Zhang, J G Sun, Z J Pei. Application of Laser scattering on detection of subsurface damage in silicon wafers. ASME 2003 International Mechanical Engineering Congress and Exposition, Washington, DC, USA, November 15–21, 2003: 15–24.
H N Li, T B Yu, L D Zhu, et al. Evaluation of grinding-induced subsurface damage in optical glass BK7. Journal of Materials Processing Technology, 2016, 229: 785–794.
J J Wang, C L Zhang, P F Feng, et al. A model for prediction of subsurface damage in rotary ultrasonic face milling of optical K9 glass. The International Journal of Advanced Manufacturing Technology, 2016, 83(1–4): 347–355.
J B Chen, Q H Fang, P Li. Effect of grinding wheel spindle vibration on surface roughness and subsurface damage in brittle material grinding. International Journal of Machine Tools and Manufacture, 2015, 91: 12–23.
D X Lv, Y H Huang, Y J Tang, et al. Relationship between subsurface damage and surface roughness of glass BK7 in rotary ultrasonic machining and conventional grinding processes. The International Journal of Advanced Manufacturing Technology, 2013, 67(1–4): 613–622.
Z Q Yao, W B Gu, K M Li. Relationship between surface roughness and subsurface crack depth during grinding of optical glass BK7. Journal of Materials Processing Technology, 2012, 212(4): 969–976.
S Y Li, Z Wang, Y L Wu. Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes. Journal of Materials Processing Technology, 2008, 205(1–3): 34–41.
J Neauport, C Ambard, H Bercegol, et al. Optimizing fused silica polishing processes for 351nm high-power laser application. Proceedings of SPIE-The International Society for Optical Engineering, 2008, 7132: 51.
W Kanematsu. Visualization of subsurface damage in silicon nitride from grinding by a plasma etching and dye impregnation method. Journal of the American Ceramic Society, 2006, 89(8): 2564–2570.
B Zhang, T Histoshi, Y Masanori. Study on surface cracking of alumina scratched by single-point diamonds. Journal of Materials Science, 1988, 23(9): 3214–3224.
J G Sun, M Shirber, W A Ellingson. Laser-based optical scattering detection of surface and subsurface defects in machined Si3N4 components. John Wiley & Sons, Inc., 1997: 273–280.
N Azeggagh, L Joly-Pottuz, D Nélias, et al. Hertzian contact damage in silicon nitride ceramics with different porosity contents. Journal of the European Ceramic Society, 2015, 35(8): 2269–2276.
B Zhang, T D Howes. Subsurface evaluation of ground ceramics. CIRP Annals—Manufacturing Technology, 1995, 44(1): 263–266.
B Zhang, J Meng. Grinding damage in fine ceramics. Nanotechnology & Precision Engineering, 2003, 1(1): 48–56. (in Chinese)
Z Wang. Study on the detection and control techniques of subsurface damage in optical fabrication. National University of Defense Technology, 2008. (in Chinese)
H K Tonshoff, B Karpuschewski, M Hartmann, et al. Grinding-and-slicing technique as an advanced technology for silicon wafer slicing. Machining Science and Technology, 1997, 1(1): 33–47.
B Zhang, T D Howes. Material-removal mechanisms in grinding ceramics. CIRP Annals—Manufacturing Technology, 1994, 43(1): 305–308.
P P Hed, D F Edwards, J B Davis. Subsurface damage in optical materials: Origin, measurement and removal: Summary. Lawrence Livermore National Lab., CA (USA), 1988.
H K Tönshoff, W V Schmieden, I Inasaki, et al. Abrasive machining of silicon. CIRP Annals-Manufacturing Technology, 1990, 39(2): 621–635.
X Tonnellier, P Shore, X Luo, et al. Wheel wear and surface/subsurface qualities when precision grinding optical materials. Proc. SPIE, 2006, 6273: 627308.
F W Huo. Study on the mechanism of ductile mode grinding of silicon wafers. Dalian University of Technology, 2006. (in Chinese)
Y X Zhang, D L Li, G Wei, et al. Experimental investigation on the detection technique for surface layer damage of machined silicon wafers. Rengong Jingti Xuebao/Journal of Synthetic Crystals, 2011, 40(2): 359–364.
Y Masanori, B Zhang, T Hitoshi. Observations of ceramic surface cracks by newly proposed methods. Yogyo-Kyokai-Shi, 1987, 95(10): 961–969. (in Japanese)
S D Jacobs, J C Lambropoulos, D Golini, et al. Use of magnetorheological finishing (MRF) to relieve residual stress and subsurface damage on lapped semiconductor silicon wafers. Proceedings of SPIE-The International Society for Optical Engineering, 2001, 4451: 286–294.
Y Y Zhou, P D Funkenbusch, D J Quesnel, et al. Effect of etching and imaging mode on the measurement of subsurface damage in microground optical-glasses. Journal of the American Ceramic Society, 1994, 77(12): 3277–3280.
F Lakhdari, D Bouzid, N Belkhir, et al. Surface and subsurface damage in Zerodur® glass ceramic during ultrasonic assisted grinding. The International Journal of Advanced Manufacturing Technology, 2017, 90(5–8): 1993–2000.
J A Randi, J C Lambropoulos, S D Jacobs. Subsurface damage in some single crystalline optical materials. Appl. Opt., 2005, 44(12): 2241–2249.
T Suratwala, L Wong, P Miller, et al. Sub-surface mechanical damage distributions during grinding of fused silica. Journal of Non-Crystalline Solids, 2006, 352(52–54): 5601–5617.
P E Miller, T I Suratwala, L L Wong, et al. The distribution of subsurface damage in fused silica. Proceedings of SPIE-The International Society for Optical Engineering, 2005: 599101–599101–25.
J A Menapace, P J Davis, W A Steele, et al. MRF applications: measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique. Proceedings of SPIE-The International Society for Optical Engineering, 2005: 599103–599103–11.
J Neauport, C Ambard, P Cormont, et al. Subsurface damage measurement of ground fused silica parts by HF etching techniques. Opt. Express, 2009, 17(22): 20448–20456.
A B Shorey, S D Jacobs, W I Kordonski, et al. Experiments and observations regarding the mechanisms of glass removal in magnetorheological finishing. Appl. Opt., 2001, 40(1): 20–33.
A B Shorey. Mechanisms of material removal in magnetorheological finishing (MRF) of glass. University of Rochester, 2000.
C Miao, S N Shafrir, J C Lambropoulos, et al. Shear stress in magnetorheological finishing for glasses. Appl. Opt., 2009, 48(13): 2585–2594.
T O Mulhearn. The deformation of metals by Vickers-type pyramidal indenters. Journal of the Mechanics and Physics of Solids, 1959, 7(2): 85–88.
J Wang, Y G Li, J H Han, et al. Evaluating subsurface damage in optical glasses. Journal of the European Optical Society-Rapid Publications, 2011, 6(11001).
S Van der Zwaag, J T Hagan, J E Field. Studies of contact damage in polycrystalline zinc sulphide. Journal of Materials Science, 1980, 15(12): 2965–2972.
H H Xu, S Jahanmir. Simple technique for observing subsurface damage in machining of ceramics. Journal of the American Ceramic Society, 1994, 77(5): 1388–1390.
F Guiberteau, N P Padture, B R Lawn. Effect of grain size on Hertzian contact damage in alumina. Journal of the American Ceramic Society, 1994, 77(7): 1825–1831.
D S Anderson, M E Frogner. A method for the evaluation of subsurface damage. Technical Digest of the Optical Fabrication and Testing Workshop. Optical Society of America, Washington DC, USA, 1985.
H Helbawi, L C Zhang, I Zarudi. Difference in subsurface damage in indented specimens with and without bonding layer. International Journal of Mechanical Sciences, 2001, 43(4): 1107–1121.
C W Carr, M J Matthews, J D Bude, et al. The effect of laser pulse duration on laser-induced damage in KDP and SiO2. Proc. SPIE, 2006: 6403.
I Zarudi, L Zhang. Subsurface damage in single-crystal silicon due to grinding and polishing. Journal of Materials Science Letters, 1996, 15(7): 586–587.
T Abe, Y Nakazato, M Daito, et al. The ductile mode grinding technology applied to silicon wafering process. Semiconductor Silicon/1994, Proceedings of the 7th International Symposium on Silicon Materials Science and Technology, The Electrochemical Society, Pennington, NJ, USA, 1994: 207–217.
H Z Wu, S G Roberts, G Möbus, et al. Subsurface damage analysis by TEM and 3D FIB crack mapping in alumina and alumina/5vol.%SiC nanocomposites. Acta Materialia, 2003, 51(1): 149–163.
L Wong, T Suratwala, M D Feit, et al. The effect of HF/NH4F etching on the morphology of surface fractures on fused silica. Journal of Non-Crystalline Solids, 2009, 355(13): 797–810.
B Ma, Z X Shen, Z Zhang, et al. Fabrication and detection technique of fused silica substrate with extremely low subsurface damage. High Power Laser & Particle Beams, 2010, 22(9): 2181–2185.
G Spierings. Wet chemical etching of silicate-glasses in hydrofluoric-acid based solutions. Journal of Materials Science, 1993, 28(23): 6261–6273.
G L Li. Theoretical and experimental research on the measurement of grinding subsurface damage for optical materials. National University of Defense Technology, 2006. (in Chinese)
Z Wang, Y L Wu, Y F Dai, et al. Rapid detection of subsurface damage of optical materials in lapping process and its influence regularity. Guangxue Jingmi Gongcheng/Optics & Precision Engineering, 2008, 16(1): 16–21.
R Sabia, H J Stevens, J R Varner. Pitting of a glass-ceramic during polishing with cerium oxide. Journal of Non-Crystalline Solids, 1999, 249(2–3): 123–130.
B Ma, Z X Shen, P F He, et al. Detection of subsurface defects of fused silica optics by confocal scattering microscopy. Chinese Optics Letters, 2010, 8(3): 296–299.
M Sergeeva, K Khrenikov, T Hellmuth, et al. Sub surface damage measurements based on short coherent interferometry. Journal of the European Optical Society-Rapid Publications, 2010, 5: 10003–1-5.
P P Hed, D F Edwards. Optical glass fabrication technology. 2: Relationship between surface roughness and subsurface damage. Appl. Opt., 1987, 26(21): 4677–4680.
J C Lambropoulos. From abrasive size to subsurface damage in grinding. Convergence, 2000, 8: 1–3.
F K Aleinikov. The effect of certain physical and mechanical properties on the grinding of brittle materials. Soviet Physics-Technical Physics, 1957, 2(12): 2529–2538.
J C Lambropoulos, Y Li, P D Funkenbusch, et al. Noncontact estimate of grinding-induced subsurface damage. SPIE’s International Symposium on Optical Science, Engineering, and Instrumentation. International Society for Optics and Photonics, 1999: 41–50
J Neauport, J Destribats, C Maunier, et al. Loose abrasive slurries for optical glass lapping. Appl. Opt., 2010, 49(30): 5736–5745.
K R Fine, R Garbe, T Gip, et al. Non-destructive real-time direct measurement of subsurface damage. Defense and Security. International Society for Optics and Photonics, Orlando, Florida, USA, March 28, 2005: 105–110.
B Lawn, R Wilshaw. Indentation fracture: principles and applications. Journal of Materials Science, 1975, 10(6): 1049–1081.
D Huang, E A Swanson, C P Lin, et al. Optical coherence tomography. Science, 1991, 254(5035): 1178–1181.
V V Tuchin, R K Wang, V V Tuchin. Optical coherence tomography: light scattering and imaging enhancement. In: Handbook of coherent-domain optical methods, Springer New York, 2013: 665–742.
M Bashkansky, M D Duncan, M Kahn, et al. Subsurface defect detection in ceramics by high-speed high-resolution optical coherent tomography. Optics Letters, 1997, 22(1): 61–63.
M Bashkansky, P R Battle, M Duncan, et al. Subsurface defect detection in ceramic materials using optical gating techniques. Review of Progress in Quantitative Nondestructive Evaluation, Springer, 1996: 1565–1572.
D O Thompson, D E Chimenti, M Bashkansky, et al. Subsurface defect detection in ceramic materials using optical gating techniques. Review of Progress in Quantitative Nondestructive Evaluation. Springer US, 1996: 1565–1572.
P R Battle, M Bashkansky, R Mahon, et al. Subsurface defect detection in ceramic materials using optical gating techniques. Optical Engineering, 1996, 35(4): 1119–1123.
M Bashkansky, P R Battle, M D Duncan, et al. Subsurface defect detection in ceramics using an optical gated scatter reflectometer. Journal of the American Ceramic Society, 1996, 79(5): 1397–1400.
M Duncan, M Bashkansky, J Reintjes. Subsurface defect detection in materials using optical coherence tomography. Opt. Express, 1998, 2(13): 540–545.
Z J Pei, S R Billingsley, S Miura. Grinding induced subsurface cracks in silicon wafers. International Journal of Machine Tools and Manufacture, 1999, 39(7): 1103–1116.
C H Wang. Study on optical sub-surface damage evaluation technology. Xi’an: Xi’an Technological University, 2010. (in Chinese)
P A Temple. Total internal reflection microscopy: a surface inspection technique. Appl. Opt., 1981, 20(15): 2656–2664.
P A Temple. Examination of laser damage sites of transparent surfaces and films using total internal reflection microscopy. Natl. Bur. Std. Spec. Publ. 1980, 568: 333–341.
F Draheim, B Harnisch, T Weigel. Subsurface damage of optical components and the influence on scattering properties. Proceedings of SPIE-The International Society for Optical Engineering, 1994: 709–720.
C F Kranenberg, K C Jungling. Subsurface damage identification in optically transparent materials using a nondestructive method. Appl. Opt., 1994, 33(19): 4248–4253.
Z M Liao, S J Cohen, J R Taylor. Total internal reflection microscopy (TIRM) as a nondestructive subsurface damage assessment tool. Proc. SPIE, 1994: 43–53.
L M Sheehan, M Kozlowski, D W Camp. Application of total internal reflection microscopy for laser damage studies on fused silica. Proceedings of SPIE-The International Society for Optical Engineering, 1998, 3244(6): 282–295.
Y Deng, Q Xu, L Q Chai, et al. Total internal reflection microscopy: A subsurface defects identification technique in optically transparent components. High Power Laser & Particle Beams, 2009, 21(6): 835–840.
A J Winn, J A Yeomans. A study of microhardness indentation fracture in alumina using confocal scanning laser microscopy. Philosophical Magazine A-Physics of Condensed Matter Structure Defects and Mechanical Properties, 1996, 74(5): 1253–1263.
B Bertussi, P Cormont, S Palmier, et al. Initiation of laser-induced damage sites in fused silica optical components. Opt. Express, 2009, 17(14): 11469–11479.
W K Lu, Z J Pei, J G Sun. Non-destructive evaluation methods for subsurface damage in silicon wafers: A literature review. International Journal of Machining and Machinability of Materials, 2007, 2(1): 125–142.
W K Lu, J G Sun, Z J. Pei Subsurface damage measurement in silicon wafers with cross-polarisation confocal microscopy. International Journal of Nanomanufacturing, 2006, 1(2): 272–282.
J Sun. Device and nondestructive method to determine subsurface micro-structure in dense materials. Argonne National Laboratory (ANL), Argonne, IL, 2006.
J M Zhang, J G Sun, Z J Pei. Subsurface damage measurement in silicon wafers by laser scattering. Trans. NAMRI/SME, 2002, 30: 535–542.
J G Sun, A Wolosewicz, M H Haselkorn, et al. Laser scattering detection and characterization of defects and machining damage in silicon nitride components. Office of Scientific & Technical Information Technical Reports, 1998.
J M Zhang, J G Sun. Quantitative assessment of subsurface damage depth in silicon wafers based on optical transmission properties. International Journal of Manufacturing Technology and Management, 2005, 7(5–6): 540–552.
J M Zhang, J G Sun, Z J Pei. Optical transmission properties of silicon wafers: theoretical analysis. ASME 2004 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, Anaheim, California, USA, November 13–19, 2004: 17–24.
J M Zhang. Laser scattering techniques for subsurface damage measurements: system development, experimental investigation, and theoretical analysis. Kansas State University, 2006.
D W Hahn. Light scattering theory. Department of Mechanical and Aerospace Engineering, Florida, 2006.
A Y Sun, B F Ju. The acoustic micro integrated detection technique for silicon wafer processing. Advanced Materials Research, 2012, 497: 151–155.
O Balogun, G D Cole, R Huber, et al. High-spatial-resolution sub-surface imaging using a laser-based acoustic microscopy technique. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2011, 58(1): 226–233.
Y V Korkh, A M Burkhanov, A B Rinkevich. Scanning acoustic microscope for visualization of microflaws in solids. Russian Journal of Nondestructive Testing, 2009, 45(10): 677–684.
C T Leondes, J Janting. Techniques in scanning acoustic microscopy for enhanced failure and material analysis of microsystems. Leondes C T, Springer US, 2006: 905–921.
D Rats, J V Stebut, F Augereau. High frequency scanning acoustic microscopy: a novel non-destructive surface analytical tool for assessment of coating-specific elastic moduli and tomographic study of subsurface defects. Thin Solid Films, 1999, s355–356(2): 347–352.
W Williams, B Mullany, W Parker, et al. Using quantum dots to evaluate subsurface damage depths and formation mechanisms in glass. CIRP Annals-Manufacturing Technology, 2010, 59(1): 569–572.
W B Williams, B A Mullany, W C Parker, et al. Using quantum dots to tag subsurface damage in lapped and polished glass samples. Applied Optics, 2009, 48(27): 5155–5163.
T Yonushonis. Manufacturing fluid including fluorescent dye penetrant and method for using to make components: U.S. Patent 6,677,584. 2004-1-13.
N Podymova, A Karabutov. Laser optoacoustic non-destructive method of thickness measurement of subsurface damaged layer in machined silicon wafers. Journal of Physics: Conference Series. IOP Publishing, 2010, 214(1): 012054.
A A KARABUTOV, N B PODYMOVA. Study on the subsurface damage depth in machined silicon wafers by the laser-ultrasonic method. Case Studies in Nondestructive Testing and Evaluation, 2014, 1: 7–12.
L Lavery, W Harris, J Gelb, et al. Recent advancements in 3D X-ray microscopes for additive manufacturing. Microscopy and Microanalysis, 2015, 21(S3): 131–132.
D J Bull, L Helfen, I Sinclair, et al. A comparison of multi-scale 3D X-ray tomographic inspection techniques for assessing carbon fibre composite impact damage. Composites Science and Technology, 2013, 75: 55–61.
J Lambert, A R Chambers, I Sinclair, et al. 3D damage characterisation and the role of voids in the fatigue of wind turbine blade materials. Composites Science and Technology, 2012, 72(2): 337–343.
S Dutta, G Saxena, K Jindal, et al. Comparison of residual stress in deep boron diffused silicon (100), (110) and (111) wafers. Materials Letters, 2013, 100: 44–46.
J W Yan. Laser micro-Raman spectroscopy of single-point diamond machined silicon substrates. Journal of Applied Physics, 2004, 95(4): 2094–2101.
D W Ingrid. Raman spectroscopy: Chips and stress. Spectroscopy Europe, 2003, 15(2): 6–13.
W Du, Q Bai, Y B Wang, et al. Eddy current detection of subsurface defects for additive/subtractive hybrid manufacturing. The International Journal of Advanced Manufacturing Technology, 2017: 1–11.
M Morozov, G Y Tian, P J Withers. Noncontact evaluation of the dependency of electrical conductivity on stress for various Al alloys as a function of plastic deformation and annealing. Journal of Applied Physics, 2010, 108(2): 024909.
Y He, M Pan, F Luo. Defect characterization based on heat diffusion using induction thermography testing. Review of Scientific Instruments, 2012, 83(10): 104702.
Y He, M Pan, G Y Tian, et al. Eddy current pulsed phase thermography for subsurface defect quantitatively evaluation. Applied Physics Letters, 2013, 103(14): 144108.
P Vourna, A Ktena, P E Tsakiridis, et al. An accurate evaluation of the residual stress of welded electrical steels with magnetic Barkhausen noise. Measurement, 2015, 71: 31–45.
J A Perez-Benitez, J Capo-Sanchez, J Anglada-Rivera, et al. A study of plastic deformation around a defect using the magnetic Barkhausen noise in ASTM 36 steel. Ndt & e International, 2008, 41(1): 53–58.
A Stupakov, M Neslušan, O Perevertov. Detection of a milling-induced surface damage by the magnetic Barkhausen noise. Journal of Magnetism and Magnetic Materials, 2016, 410: 198–209.
K Ravi-Chandar, W G Knauss. An experimental investigation into dynamic fracture: I. Crack initiation and arrest. International Journal of Fracture, 1984, 25(4): 247–262.
K Ravi-Chandar, W G Knauss. An experimental investigation into dynamic fracture: II. Microstructural aspects. International Journal of Fracture, 1984, 26(1): 65–80.
K Ravi-Chandar, W G Knauss. An experimental investigation into dynamic fracture: III. On steady-state crack propagation and crack branching. International Journal of fracture, 1984, 26(2): 141–154.
K Ravi-Chandar, W G Knauss. An experimental investigation into dynamic fracture: IV. On the interaction of stress waves with propagating cracks. International Journal of Fracture, 1984, 26(3): 189–200.
J Y Shen, J Q Wang, B Jiang, et al. Study on wear of diamond wheel in ultrasonic vibration-assisted grinding ceramic. Wear, 2015, 332: 788–793.
Q Zhang, S To, Q Zhao, et al. Impact of material microstructure and diamond grit wear on surface finish in micro-grinding of RB-SiC/Si and WC/Co carbides. International Journal of Refractory Metals and Hard Materials, 2015, 51: 258–263.