Liquid metal enabled combinatorial heat transfer science: toward unconventional extreme cooling
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Theis T N, Wong H S P. The end of Moore’s law: a new beginning for information technology. Computing in Science & Engineering, 2017, 19(2): 41–50
Sohel Murshed S M, Nieto de Castro C A. A critical review of traditional and emerging techniques and fluids for electronics cooling. Renewable & Sustainable Energy Reviews, 2017, 78: 821–833
Agostini B, Fabbri M, Park J E, Wojtan L, Thome J R, Michel B. State of the art of high heat flux cooling technologies. Heat Transfer Engineering, 2007, 28(4): 258–281
Luo X, Hu R, Liu S, Wang K. Heat and fluid flow in high-power LED packaging and applications. Progress in Energy and Combustion Science, 2016, 56: 1–32
Alpsan E. Experimental investigation and numerical analysis of microchannel heatsinks for phased array radar cooling applications. Dissertation for the Master’s Degree. Ankara, Turkey: Middle East Technical University, 2008
Kim H, Wi H, Park S, Seon S, Hong Y, Kim J, Choi S. RF test and thermal analysis on high power water load for 30 kW microwave of 2450 MHz applications. In: IEEE International Conference on Plasma Science, 2016, 1–8
Jakhar S, SoniM S, Gakkhar N. Historical and recent development of concentrating photovoltaic cooling technologies. Renewable & Sustainable Energy Reviews, 2016, 60: 41–59
Bahman A S, Blaabjerg F. Optimization tool for direct water cooling system of high power IGBT modules. In: European Conference on Power Electronics and Applications, 2016, 1–10
Wang C C. A quick overview of compact air-cooled heat sinks applicable for electronic cooling-recent progress. Inventions, 2017, 2(1): 5–31
Faghri A. Heat pipes: review, opportunities and challenges. Frontiers in Heat Pipes, 2014, 5(1): 1–48
Sharma C S, Schlottig G, Brunschwiler T, Tiwari M K, Michel B, Poulikakos D. A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: an experimental study. International Journal of Heat and Mass Transfer, 2015, 88: 684–694
Xie X, Liu Z, He Y, Tao W. Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink. Applied Thermal Engineering, 2009, 29 (1): 64–74
Wang H, Chen Z, Gao J. Influence of geometric parameters on flow and heat transfer performance of micro-channel heat sinks. Applied Thermal Engineering, 2016, 107: 870–879
Yang F, Dai X, Peles Y, Cheng P, Khan J, Li C. Flow boiling phenomena in a single annular flow regime in microchannels (I): characterization of flow boiling heat transfer. International Journal of Heat and Mass Transfer, 2014, 68: 703–715
Sun Y, Wang Y, Zhu L, Yin B, Xiang H, Huang Q. Direct liquidimmersion cooling of concentrator silicon solar cells in a linear concentrating photovoltaic receiver. Energy, 2014, 65: 264–271
Bahaidarah H M. Experimental performance evaluation and modeling of jet impingement cooling for thermal management of photovoltaics. Solar Energy, 2016, 135: 605–617
Hsieh C C, Yao S C. Evaporative heat transfer characteristics of a water spray on micro-structured silicon surfaces. International Journal of Heat and Mass Transfer, 2006, 49(5–6): 962–974
Zhao D, Tan G. A review of thermoelectric cooling: materials, modeling and applications. Applied Thermal Engineering, 2014, 66(S1–2): 15–24
Catano J, Zhang T, Wen J T, Jensen M K, Peles Y. Vapor compression refrigeration cycle for electronics cooling–Part I: dynamic modeling and experimental validation. International Journal of Heat and Mass Transfer, 2013, 66: 911–921
Catano J, Lizarralde F, Zhang T, Wen J T, Jensen M K, Peles Y. Vapor compression refrigeration cycle for electronics cooling–Part II: gain-scheduling control for critical heat flux avoidance. International Journal of Heat and Mass Transfer, 2013, 66: 922–929
Jaworski M. Thermal performance of heat spreader for electronics cooling with incorporated phase change material. Applied Thermal Engineering, 2011, 35(1): 212–219
Azizi Y, Sadrameli S. Thermal management of a LiFePO4 battery pack at high temperature environment using a composite of phase change materials and aluminum wire mesh plates. Energy Conversion and Management, 2016, 128: 294–302
Shao L, Raghavan A, Kim G H, Emurian L, Rosen J, Papaefthymiou M C, Wenisch T F, Martin M M, Pipe K P. Figure-of-merit for phase-change materials used in thermal management. International Journal of Heat and Mass Transfer, 2016, 101: 764–771
Wu Y, Tang Y, Li Z, Ding X, Yuan W, Zhao X, Yu B. Experimental investigation of a PCM-HP heat sink on its thermal performance and anti-thermal-shock capacity for high-power LEDs. Applied Thermal Engineering, 2016, 108: 192–203
Liu J, Zhou Y. A computer chip cooling method which uses low melting point metal and its alloys as the cooling fluid. China Patent, 2002, 2131419
Li T, Lv Y G, Liu J. Computer chip cooling method using low melting point liquid metal or its alloy as the cooling fluid. In: Annual Heat and Mass Transfer Conference of the Chinese Society of Engineering Thermophysics, 2004, 1: 115–118
Liu J, Zhou Y X, Lv Y G, Li T. Liquid metal based miniaturized chip-cooling device driven by electromagnetic pump. In: ASME 2005 International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers, 2005, 501–510
Miner A, Ghoshal U. Cooling of high-power-density microdevices using liquid metal coolants. Applied Physics Letters, 2004, 85(3): 506–508
Ghoshal U, Grimm D, Ibrani S, Johnston C, Miner A. Highperformance liquid metal cooling loops. In: 21st IEEE SEMITHERM Symposium, 2005, 1–4
Ma K Q, Liu J. Heat-driven liquid metal cooling device for the thermal management of a computer chip. Journal of Physics. D, Applied Physics, 2007, 40(15): 4722–4729
Ma K Q, Liu J. Nano liquid-metal fluid as ultimate coolant. Physics Letters [Part A], 2007, 361(3): 252–256
Deng Y, Liu J. Hybrid liquid metal–water cooling system for heat dissipation of high power density microdevices. Heat and Mass Transfer, 2010, 46(11–12): 1327–1334
Deng Y, Liu J. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs. Journal of Electronic Packaging, 2010, 132(3): 031009
Deng Y, Liu J. A liquid metal cooling system for the thermal management of high power LEDs. International Communications in Heat and Mass Transfer, 2010, 37(7): 788–791
Deng Y, Liu J. Heat spreader based on room-temperature liquid metal. ASME Journal of Thermal Science and Engineering Applications, 2012, 4(2): 024501
Luo M, Zhou Y, Liu J. Blade heat dissipator with roomtemperature liquid metal running inside a sheet of hollow chamber. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2014, 4(3): 459–464
Vetrovec J. Quasi-passive heat sink for high-power laser diodes. In: Zediker M S ed. SPIE Proceedings, High-Power Diode Laser Technology and Applications VII, 2009, 7198
Vetrovec J, Litt A S, Copeland D A, Junghans J, Durkee R. Liquid metal heat sink for high-power laser diodes. In: SPIE LASE International Society for Optics and Photonics, 2013, 86050E–86050E–86057
Vetrovec J. Engine cooling system with overload handling capability. Google Patents, 2010
Vetrovec J. High-performance heat sink for interfacing hybrid electric vehicles inverters to engine coolant loop. SAE Technical Paper, 2011, 0148–7191
Deng Y G, Liu J, Zhou Y X. Liquid metal based mini/micro channel cooling device. In: ASME 2009 7th International Conference on Nanochannels, Microchannels, and Minichannels, American Society of Mechanical Engineers, 2009, 253–259
Hodes M, Zhang R, Wilcoxon R, Lower N. Cooling potential of galinstan-based minichannel heat sinks. In: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012, 297–302
Luo M, Liu J. Experimental investigation of liquid metal alloy based mini-channel heat exchanger for high power electronic devices. Frontiers in Energy, 2013, 7(4): 479–486
Hodes M, Zhang R, Lam L S, Wilcoxon R, Lower N. On the potential of galinstan-based minichannel and minigap cooling. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2014, 4(1): 46–56
Liu N, Jin Y, Miao M, Cui X. Optimization of heat transfer of microchannels in LTCC substrate with via holes and liquid metal. In: 17th International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2016, 1135–1139
Liu Y, Chen H, Zhang H, Li Y. Heat transfer performance of lotustype porous copper heat sink with liquid GaInSn coolant. International Journal of Heat and Mass Transfer, 2015, 80: 605–613
Yang X H, Tan S C, Ding Y J, Liu J. Flow and thermal modeling and optimization of micro/mini-channel heat sink. Applied Thermal Engineering, 2017, 117: 289–296
Li H, Liu J. Revolutionizing heat transport enhancement with liquid metals: proposal of a new industry of water-free heat exchangers. Frontiers in Energy, 2011, 5(1): 20–42
Li P, Liu J. Harvesting low grade heat to generate electricity with thermosyphon effect of room temperature liquid metal. Applied Physics Letters, 2011, 99(9): 094106
Li P, Liu J. Self-driven electronic cooling based on thermosyphon effect of room temperature liquid metal. ASME Journal of Electronic Packaging, 2011, 133(4): 041009
Li P, Liu J, Zhou Y. Design of a self-driven liquid metal cooling device for heat dissipation of hot chips in a closed cabinet. Journal of Thermal Science and Engineering Applications, 2013, 6(1): 011009
Gao Y, Liu J. Gallium-based thermal interface material with high compliance and wettability. Applied Physics. A, Materials Science & Processing, 2012, 107(3): 701–708
Ge H, Li H, Mei S, Liu J. Low melting point liquid metal as a new class of phase change material: an emerging frontier in energy area. Renewable & Sustainable Energy Reviews, 2013, 21: 331–346
Ge H, Liu J. Phase change effect of low melting point metal for an automatic cooling of USB flash memory. Frontiers in Energy, 2012, 6(3): 207–209
Ge H, Liu J. Keeping smartphones cool with gallium phase change material. ASME Journal of Heat Transfer, 2013, 135(5): 054503
Li Z, Lv L, Li J. Combination of heat storage and thermal spreading for high power portable electronics cooling. International Journal of Heat and Mass Transfer, 2016, 98: 550–557
Fan L W, Wu Y Y, Xiao Y Q, Zeng Y, Zhang Y L, Yu Z T. Transient performance of a thermal energy storage-based heat sink using a liquid metal as the phase change material. Applied Thermal Engineering, 2016, 109: 746–750
Alipanah M, Li X. Numerical studies of lithium-ion battery thermal management systems using phase change materials and metal foams. International Journal of Heat and Mass Transfer, 2016, 102: 1159–1168
Yang X H, Tan S C, Liu J. Numerical investigation of the phase change process of low melting point metal. International Journal of Heat and Mass Transfer, 2016, 100: 899–907
Yang X H, Tan S C, He Z Z, Zhou Y X, Liu J. Evaluation and optimization of low melting point metal PCM heat sink against ultra-high thermal shock. Applied Thermal Engineering, 2017, 119: 34–41
Fleischer A S. Thermal Energy Storage Using Phase Change Materials: Fundamentals and Applications. Berlin: Springer, 2015
Yang X H, Tan S C, Ding Y J, Wang L, Liu J, Zhou Y X. Experimental and numerical investigation of low melting point metal based PCM heat sink with internal fins. International Communications in Heat and Mass Transfer, 2017, 87: 118–124
Tan S C, Zhou Y X, Wang L, Liu J. Electrically driven chip cooling device using hybrid coolants of liquid metal and aqueous solution. Science China, Technological Sciences, 2016, 59(2): 301–308
Yang X H, Tan S C, Yuan B, Liu J. Alternating electric field actuated oscillating behavior of liquid metal and its application. Science China, Technological Sciences, 2016, 59(4): 597–603
Tang J, Wang J, Liu J, Zhou Y. A volatile fluid assisted thermopneumatic liquid metal energy harvester. Applied Physics Letters, 2016, 108(2): 023903
Bergman T L, Incropera F P, Lavine A S. Fundamentals of Heat and Mass Transfer. Hoboke: John Wiley & Sons, 2011
Lee S, Song S, Au V, Moran K P. Constriction/spreading resistance model for electronics packaging. In: Proceedings of the 4th ASME/JSME Thermal Engineering Joint Conference, 1995, 199–206
Wei J. Challenges in cooling design of CPU packages for highperformance servers. Heat Transfer Engineering, 2008, 29(2): 178–187
Sauciuc I, Chrysler G, Mahajan R, Prasher R. Spreading in the heat sink base: phase change systems or solid metals? IEEE Transactions on Components and Packaging Technologies, 2002, 25(4): 621–628
Hsieh S S, Lee R Y, Shyu J C, Chen S W. Thermal performance of flat vapor chamber heat spreader. Energy Conversion and Management, 2008, 49(6): 1774–1784
Li H Y, Chiang M H, Lee C I, Yang W J. Thermal performance of plate-fin vapor chamber heat sinks. International Communications in Heat and Mass Transfer, 2010, 37(7): 731–738
Lee H S. Thermal Design: Heat Sinks, Thermoelectrics, Heat pipes, Compact Heat Exchangers, and Solar Cells. Hoboke: John Wiley & Sons, 2010
Li H Y, Chao S M. Measurement of performance of plate-fin heat sinks with cross flow cooling. International Journal of Heat and Mass Transfer, 2009, 52(13–14): 2949–2955
Al-Sallami W, Al-Damook A, Thompson H. A numerical investigation of thermal airflows over strip fin heat sinks. International Communications in Heat and Mass Transfer, 2016, 75: 183–191
Krishnan S, Hernon D, Hodes M, Mullins J, Lyons A M. Design of complex structured monolithic heat sinks for enhanced air cooling. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2012, 2(2): 266–277
Han X H, Wang Q, Park Y G, T’Joen C, Sommers A, Jacobi A. A review of metal foam and metal matrix composites for heat exchangers and heat sinks. Heat Transfer Engineering, 2012, 33 (12): 991–1009
Yang K S, Chiang C M, Lin Y T, Chien K H, Wang C C. On the heat transfer characteristics of heat sinks: influence of fin spacing at low Reynolds number region. International Journal of Heat and Mass Transfer, 2007, 50(13–14): 2667–2674
Yang K S, Jhong J H, Lin Y T, Chien K H, Wang C C. On the heat transfer characteristics of heat sinks: with and without vortex generators. IEEE Transactions on Components and Packaging Technologies, 2010, 33(2): 391–397
Wang C C, Yang K S, Liu Y P, Chen Y. Effect of cannelure fin configuration on compact aircooling heat sink. Applied Thermal Engineering, 2011, 31(10): 1640–1647
Kanargi O B, Lee P S, Yap C. A numerical and experimental investigation of heat transfer and fluid flow characteristics of a cross-connected alternating converging–diverging channel heat sink. International Journal of Heat and Mass Transfer, 2017, 106: 449–464
Zhai Y, Ma Y, David S N, Zhao D, Lou R, Tan G, Yang R, Yin X. Scalable-manufactured randomized glass-polymer hybrid metamaterial for daytime radiative cooling. Science, 2017, 355(6329): 1062–1066
Roberts J K, Reese S D. High power radiation emitter device and heat dissipating package for electronic components. Google Patents, 2003
Goldberg N. Narrow channel forced air heat sink. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984, 7(1): 154–159
Knight R, Goodling J, Hall D. Optimal thermal design of forced convection heat sinks-analytical. Journal of Electronic Packaging, 1991, 113(3): 313–321
Koito Y, Imura H, Mochizuki M, Saito Y, Torii S. Fundamental experiments and numerical analyses on heat transfer characteristics of a vapor chamber (Effect of heat source size). JSME International Journal, Series B, Fluids and Thermal Engineering, 2006, 49(4): 1233–1240
Yazawa K, Ishizuka M. A study of channel optimization in cooling spreader on a smaller and transient heat source. Journal of the Electrochemical Society, 2005, 145(5): 1550–1560
Jegadheeswaran S, Pohekar S D. Performance enhancement in latent heat thermal storage system: a review. Renewable & Sustainable Energy Reviews, 2009, 13(9): 2225–2244
Krishnan S, Garimella S V, Kang S S. A novel hybrid heat sink using phase change materials for transient thermal management of electronics. IEEE Transactions on Components and Packaging Technologies, 2005, 28(2): 281–289
Akhilesh R, Narasimhan A, Balaji C. Method to improve geometry for heat transfer enhancement in PCM composite heat sinks. International Journal of Heat and Mass Transfer, 2005, 48(13): 2759–2770
Kandasamy R, Wang X Q, Mujumdar A S. Transient cooling of electronics using phase change material (PCM)-based heat sinks. Applied Thermal Engineering, 2008, 28(8–9): 1047–1057
Robak C W, Bergman T L, Faghri A. Enhancement of latent heat energy storage using embedded heat pipes. International Journal of Heat and Mass Transfer, 2011, 54(15–16): 3476–3484
Zhao C Y, Lu W, Tian Y. Heat transfer enhancement for thermal energy storage using metal foams embedded within phase change materials (PCMs). Solar Energy, 2010, 84(8): 1402–1412
He Q, Wang S, Tong M, Liu Y. Experimental study on thermophysical properties of nanofluids as phase-change material (PCM) in low temperature cool storage. Energy Conversion and Management, 2012, 64: 199–205
Abdollahzadeh M, Esmaeilpour M. Enhancement of phase change material (PCM) based latent heat storage system with nano fluid and wavy surface. International Journal of Heat and Mass Transfer, 2015, 80: 376–385
Hu H M, Ge T S, Dai Y J, Wang R Z. Experimental study on watercooled thermoelectric cooler for CPU under severe environment. International journal of refrigeration, 2016, 62(6): 30–38
Schmidt R R, Notohardjono B D. High-end server low-temperature cooling. IBM Journal of Research and Development, 2002, 46(6): 739–751
Shamberger P J. Cooling capacity figure of merit for phase change materials. Journal of Heat Transfer, 2015, 138(2): 024502
Baby R, Balaji C. Thermal optimization of PCM based pin fin heat sinks: an experimental study. Applied Thermal Engineering, 2013, 54(1): 65–77
Pakrouh R, Hosseini M J, Ranjbar A A. A parametric investigation of a PCM-based pin fin heat sink. Mechanical Sciences, 2015, 6(1): 65–73
Naghavi M S, Ong K S, Mehrali M, Badruddin I A, Metselaar H S C. A state-of-the-art review on hybrid heat pipe latent heat storage systems. Energy Conversion and Management, 2015, 105: 1178–1204
Yin H, Gao X, Ding J, Zhang Z. Experimental research on heat transfer mechanism of heat sink with composite phase change materials. Energy Conversion and Management, 2008, 49(6): 1740–1746
Weng Y C, Cho H P, Chang C C, Chen S L. Heat pipe with PCM for electronic cooling. Applied Energy, 2011, 88(5): 1825–1833
Bezerra Helbing T, Schmitz G. Experimental analysis of latent heat storages integrated into a liquid cooling system for the cooling of power electronics. International Refrigeration and Air Conditioning Conference, 2016
Riffat S B, Omer S A, Ma X. A novel thermoelectric refrigeration system employing heat pipes and a phase change material: an experimental investigation. Renewable Energy, 2001, 23(2): 313–323
Kays W M, Crawford M E, Weigand B. Convective heat and mass transfer. Tata McGraw-Hill Education, 2012
Müller D I U, Bühler D I L, Dulikravich G S. Magnetofluid dynamics in channels and containers. Applied Mechanics Reviews, 2002, 55(1): B14
Yang X H, Tan S C, Liu J. Thermal management of Li-ion battery with liquid metal. Energy Conversion and Management, 2016, 117: 577–585
Chein R, Chen Y. Performances of thermoelectric cooler integrated with microchannel heat sinks. International journal of refrigeration, 2005, 28(6): 828–839
Mei S F. Investigation on liquid metal enhanced cooling method for high power density LEDs. Dissertation for the Master’s Degree. Beijing: University of Chinese Academy of Sciences, 2014
Yu L J. Experimental study on liquid metal remote cooling method for high power density LEDs. Dissertation for the Master’s Degree. Beijing: University of Chinese Academy of Sciences, 2016
Chen Y. Study on new RF hyperthermia methods and their performances. Dissertation for the Master’s Degree. Beijing: University of Chinese Academy of Sciences, 2015