Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
Zhejiang University Press - 2023
Tóm tắt
This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response, and is based on glass packaging material and through-glass via (TGV) technologies. Compared to traditional packaging materials (printed circuit board, low temperature co-fired ceramic, Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging devices) and have superior microwave performance. Glass substrate can realize 3D high-density interconnection through bonding technology, while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore, the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The BPF unit has three pairs of λg/4 slots (defect microstrip structure, DMS) and two λg/2 U-shaped slots (defect ground structure, DGS). The proposed antenna achieves large bandwidth and high radiation efficiency, which may be related to the stacking of glass substrate and TGV feed. In addition, the introduction of four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design, a 33-GHz broadband filtering antenna is optimized, debugged, and measured. The antenna could achieve |S11|<−10 dB in 29.4–36.4 GHz, and yield an impedance matching bandwidth up to 21.2%, with the stopband suppression level at higher than 16.5 dB. The measurement results of the proposed antenna are a realized gain of ∼6.5 dBi and radiation efficiency of ∼89%.
Từ khóa
Tài liệu tham khảo
Cao YF, Zhang Y, Zhang XY, 2020. Filtering antennas: from innovative concepts to industrial applications. Front Inform Technol Electron Eng, 21(1):116–127. https://doi.org/10.1631/FITEE.1900474
Chen L, Yang XF, Yu DQ, 2021. Development of through glass via technology. Electr Packag, 21(4):040101 (in Chinese).
El-Halwagy W, Mirzavand R, Melzer J, et al., 2018. Investigation of wideband substrate-integrated vertically-polarized electric dipole antenna and arrays for mm-wave 5G mobile devices. IEEE Access, 6:2145–2157. https://doi.org/10.1109/ACCESS.2017.2782083
Fang Z, Gao LB, Chen HW, et al., 2022. 3D interdigital electrodes dielectric capacitor array for energy storage based on through glass vias. Adv Mater Technol, 7(8):2101530. https://doi.org/10.1002/admt.202101530
He YQ, Rao ML, Liu YJ, et al., 2020. 28/39-GHz dual-band dual-polarized millimeter wave stacked patch antenna array for 5G applications. Int Workshop on Antenna Technology, p.1–4. https://doi.org/10.1109/iWAT48004.2020.1570609770
Hu HT, Chan KF, Chan CH, 2022. 60 GHz Fabry-Pérot cavity filtering antenna driven by an SIW-fed filtering source. IEEE Trans Antenn Propag, 70(2):823–834. https://doi.org/10.1109/TAP.2021.3111277
Hu KZ, Tang MC, Li DJ, et al., 2020. Design of compact, single-layered substrate integrated waveguide filtenna with parasitic patch. IEEE Trans Antenn Propag, 68(2):1134–1139. https://doi.org/10.1109/TAP.2019.2938574
Hu PF, Pan YM, Zhang XY, et al., 2016. A compact filtering dielectric resonator antenna with wide bandwidth and high gain. IEEE Trans Antenn Propag, 64(8):3645–3651. https://doi.org/10.1109/TAP.2016.2565733
Hu PF, Pan YM, Zhang XY, et al., 2019. A filtering patch antenna with reconfigurable frequency and bandwidth using F-shaped probe. IEEE Trans Antenn Propag, 67(1):121–130. https://doi.org/10.1109/TAP.2018.2877301
Hwang IJ, Jo HW, Kim JW, et al., 2017. Vertically stacked folded dipole antenna using multi-layer for mm-wave mobile terminals. IEEE Int Symp on Antennas and Propagation & USNC/URSI National Radio Science Meeting, p.2579–2580. https://doi.org/10.1109/apusncursinrsm.2017.8073332
Jin JY, Liao SW, Xue Q, 2018. Design of filtering-radiating patch antennas with tunable radiation nulls for high selectivity. IEEE Trans Antenn Propag, 66(4):2125–2130. https://doi.org/10.1109/TAP.2018.2804661
Li JF, Chen ZN, Wu DL, et al., 2018. Dual-beam filtering patch antennas for wireless communication application. IEEE Trans Antenn Propag, 66(7):3730–3734. https://doi.org/10.1109/TAP.2018.2835519
Li JF, Mao CX, Wu DL, et al., 2021. A dual-beam wideband filtering patch antenna with absorptive band-edge radiation nulls. IEEE Trans Antenn Propag, 69(12):8926–8931. https://doi.org/10.1109/TAP.2021.3097359
Li WL, Zhang JH, Gao LB, et al., 2023. Wideband analysis and prolongation of surrounding TGVs shielding structure in 3-D ICs. IEEE Microw Wirel Technol Lett, 33(1):39–42. https://doi.org/10.1109/LMWC.2022.3201523
Li WX, Xu KD, Tang XH, et al., 2017. Substrate integrated waveguide cavity-backed slot array antenna using highorder radiation modes for dual-band applications in K-band. IEEE Trans Antenn Propag, 65(9):4556–4565. https://doi.org/10.1109/TAP.2017.2723089
Liu YT, Leung KW, Yang N, 2020. Compact absorptive filtering patch antenna. IEEE Trans Antenn Propag, 68(2):633–642. https://doi.org/10.1109/TAP.2019.2938798
Shah U, Liljeholm J, Campion J, et al., 2018. Low-loss, high-linearity RF interposers enabled by through glass vias. IEEE Microw Wirel Compon Lett, 28(11):960–962. https://doi.org/10.1109/LMWC.2018.2869285
Shao ZJ, Zhang YP, 2021. A single-layer miniaturized patch antenna based on coupled microstrips. IEEE Antenn Wirel Propag Lett, 20(5):823–827. https://doi.org/10.1109/LAWP.2021.3064908
Su YQ, Yu DQ, Ruan WB, et al., 2022. Development of compact millimeter-wave antenna by stacking of five glass wafers with through glass vias. IEEE Electron Device Lett, 43(6):934–937. https://doi.org/10.1109/LED.2022.3168877
Watanabe AO, Lin TH, Ali M, et al., 2020. Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias. IEEE Trans Microw Theory Techn, 68(12):5082–5092. https://doi.org/10.1109/TMTT.2020.3022357
Wu QS, Zhang X, Zhu L, 2018. Co-design of a wideband circularly polarized filtering patch antenna with three minima in axial ratio response. IEEE Trans Antenn Propag, 66(10):5022–5030. https://doi.org/10.1109/TAP.2018.2856104
Xia HY, Zhang T, Li LM, et al., 2020. A 1×2 taper slot antenna array with flip-chip interconnect via glass-IPD technology for 60 GHz radar sensors. IEEE Access, 8:61790–61796. https://doi.org/10.1109/ACCESS.2020.2983485
Yao SS, Cheng YJ, Zhou MM, et al., 2020. D-band wideband air-filled plate array antenna with multistage impedance matching based on MEMS micromachining technology. IEEE Trans Antenn Propag, 68(6):4502–4511. https://doi.org/10.1109/TAP.2020.2969890
Zhang BH, Xue Q, 2018. Filtering antenna with high selectivity using multiple coupling paths from source/load to resonators. IEEE Trans Antenn Propag, 66(8):4320–4325. https://doi.org/10.1109/TAP.2018.2839968
Zhang XY, Duan W, Pan YM, 2015. High-gain filtering patch antenna without extra circuit. IEEE Trans Antenn Propag, 63(12):5883–5888. https://doi.org/10.1109/TAP.2015.2481484
Zhang XY, Zhang Y, Pan YM, et al., 2017. Low-profile dualband filtering patch antenna and its application to LTE MIMO system. IEEE Trans Antenn Propag, 65(1):103–113. https://doi.org/10.1109/TAP.2016.2631218