Ion-beam sputter deposition process for Y1Ba2Cu3O7-δ thin-film structures

Journal of Materials Research - Tập 9 - Trang 2747-2760 - 2011
J-P. Krumme1, V. Doormann1, F. Welz1, O. Dösssel1, H. Van Hal2
1Philips GmbH Forschungslaboratorien, Forschungsabteilung Technische Systeme Hamburg, Hamburg, Germany
2Philips Research, Natuurkundig Laboratorium, JA Eindhoven, The Netherlands

Tóm tắt

Ion-beam sputter deposition (IBS) has been developed to a fully oxygen-compatible technology for growth of complex oxides, such as Y1Ba2Cu3O7−δ (YBCO) thin films. The IBS system consists of an rf-plasma ion source with molybdenum grids for sputtering, a dc-plasma electron source for space charge compensation, stoichiometric YBCO and NGO targets, a beam chopper with BaO2, Cu, and Nd blades for stoichiometry control, and an ECR-oxygen-plasma source for in situ film oxidation and photoresist removal. Due to its complexity the IBS process is fully computer-controlled. A salient feature of IBS is the excellent crystallographic and morphological properties of thin (100)/(010)- and (103)-oriented YBCO films on SrTiO3 (STO) and NdGaO3 (NGO) substrates. Sharp interfaces and good superconducting properties render this technology feasible for the fabrication of SIS-ramp-junction SQUID’s.

Tài liệu tham khảo

J. P. Doyle, R. A. Roy, and J. J. Cuomo, Thin Solid Films 193/194, 832 (1990). J. Fujita, T. Yoshitake, H. Igarashi, and T. Satoh, Appl. Phys. Lett. 56, 295 (1990). A. Gauzzi, M. L. Lucia, B. J. Kellett, J. H. James, and D. Pavuna, Physica C 182, 57 (1991). J-P. Krumme, V. Doormann, F. Welz, R. Eckart, O. Dössel, W. Dingen, and K. Schiffmann, J. Mater. Res., Dec. 1994. D. Grundler, J-P. Krumme, and B. David, Appl. Phys. Lett., Oct. 1994. P. O’Keeffe, S. Komuro, S. Den, T. Morikawa, and Y. Aoyagi, Jpn. J. Appl. Phys. 30, L834 (1991). A. Tsukamoto, M. Hiratani, T. Aida, Y. Tarutani, and K. Takagi, in Low Energy Ion Beam and Plasma Modification of Materials, edited by J. M. E. Harper, K. Miyake, J. R. McNeil, and S. M. Gorbatkin (Mater. Res. Soc. Symp. Proc. 223, Pittsburgh, PA, 1991), pp. 135–145. T. Hashimoto, H. Koinuma, and K. Kishio, Jpn. J. Appl. Phys. 30, 1685 (1991). A. C. Westerheim, L. S. Yu-Jahnes, and A. C. Anderson, IEEE Trans. MAG-27, 1001 (1991). K. Yamamoto, B. M. Lairson, C. B. Eom, R. H. Hammond, J. C. Bravman, and T. H. Geballe, Appl. Phys. Lett. 57, 1936 (1990). K. Yamamoto, B. M. Lairson, J. C. Bravman, and T. H. Geballe, J. Appl. Phys. 69, 7189 (1991). J. P. Booth and N. Sadeghi, J. Appl. Phys. 70, 611 (1991). J. P. Booth, O. Joubert, J. Pelletier, and N. Sadeghi, J. Appl. Phys. 69, 618 (1991). L. S. Yu-Jahnes, W. T. Brogan, A. C. Anderson, and M. J. Cima, Rev. Sci. Instrum. 63, 4149 (1992). C. C. Chin, H. Takahashi, T. Morishita, and T. Sugimoto, J. Mater. Res. 8, 951 (1993). A. de Veirman and J-P. Krumme, unpublished. E. A. Giess, R. L. Sandstrom, W. J. Gallagher, A. Gupta, S. L. Shinde, R. F. Cook, E. I. Cooper, E. J. M. O’Sullivan, J. M. Roldan, A. P. Segmüller, and J. Agilello, IBM J. Res. Dev. 34, 916 (1990). M. Sasaura, S. Miyazawa, and M. Mukaida, J. Appl. Phys. 68, 3643 (1990).