Interplay of physical and chemical aspects in the PECVD and etching of thin solid films

C. Cavallotti1, M. Di Stanislao1, S. Carrà1
1Department Chimica, Materiali e Ingegneria Chimica “Giulio Natta”, Politecnico di Milano, Via Mancinelli 7, I 20131 Milano, Italy

Tài liệu tham khảo

Lieberman, 1994 Golant, 1980 Smirnov, 1981 Hess, 1993 Kummer, 2002, Mater. Sci. Eng. B, 89, 288, 10.1016/S0921-5107(01)00801-7 Lymberopoulos, 1995, J. Res. Natl. Inst. Stand. Technol., 100, 473, 10.6028/jres.100.036 Jaeger, 1995, Plasma Phys., 2, 2597, 10.1063/1.871222 Chatam, 1984, J. Chem. Phys., 81, 1770, 10.1063/1.447848 Christophorou, 2000, J. Phys. Chem. Ref. Data, 29 Peterson, 1972, J. Chem. Phys., 56, 6068, 10.1063/1.1677156 Sommerer, 1991, Appl. Phys. Lett., 59, 638, 10.1063/1.105409 Sommerer, 1992, J. Vac. Sci. Technol. B, 10, 2179, 10.1116/1.586186 Margenau, 1946, Phys. Rev., 69, 508, 10.1103/PhysRev.69.508 Myers, 1969, J. Phys., B2, 393 Eliason, 1959, J. Chem. Phys., 30, 1426, 10.1063/1.1730216 Wu, 2004, Science, 306, 2227, 10.1126/science.1104085 Fascella, 2004, J. Phys. Chem. A, 108, 3829, 10.1021/jp037518k Cavallotti, 2002, J. Phys. Chem. A, 106, 7769, 10.1021/jp025922y Cavallotti, 2004, J. Cryst. Growth, 268, 76, 10.1016/j.jcrysgro.2004.04.033 Godyak, 2003, Plasma Phys. Control. Fusion, 45, A399, 10.1088/0741-3335/45/12A/026 Graves, 1986, IEEE Trans. Plasma Sci., 14, 78, 10.1109/TPS.1986.4316510 Bell, 1970, Ind. Eng. Chem., 9, 160 Bell, 1978, Solid State Technol. Porteous, 1991, IEEE Trans. Plasma Sci., 19, 204, 10.1109/27.106815 Stewart, 1994, J. Vac. Sci. Technol. B, 12, 478, 10.1116/1.587102 Stewart, 1995, Plasma Sources Sci. Technol., 4, 36, 10.1088/0963-0252/4/1/005 Wu, 1995, Plasma Sources Sci. Technol., 4, 22, 10.1088/0963-0252/4/1/003 Meyyappan, 1993, J. Appl. Phys., 74, 2250, 10.1063/1.354708 Cavallotti, 1998, J. Electrochem. Soc., 145, 4332, 10.1149/1.1838960 Masi, 1998, Chem. Eng. Sci., 53, 3875, 10.1016/S0009-2509(98)00197-3 Boudart, 1984 Lieberman, 1988, IEEE Trans. Plasma Sci., 16, 638, 10.1109/27.16552 Godyak, 1990, Phys. Rev. A, 42, 2299, 10.1103/PhysRevA.42.2299 Coburn, 1974, J. Appl. Phys., 50, 3186 Graves, 2002, Appl. Surf. Sci., 192, 72, 10.1016/S0169-4332(02)00021-1 Satake, 2003, J. Vac. Sci. Technol. A, 21, 484, 10.1116/1.1554939 Von Keudell, 1994, J. Appl. Phys., 75, 7718, 10.1063/1.356603 Zhang, 2001, J. Vac. Sci. Technol. A, 19, 524, 10.1116/1.1349728 Zhang, 2000, J. Vac. Sci. Technol. A, 18, 2661, 10.1116/1.1319816 Stout, 1993, J. Vac. Sci. Technol. A, 11, 2562, 10.1116/1.578607 Miyagawa, 2001, Surf. Coat. Technol., 136, 122, 10.1016/S0257-8972(00)01040-9 Barone, 1996, Plasma Sources Sci. Technol., 5, 187, 10.1088/0963-0252/5/2/011 Harris, 1993, J. Phys. Chem., 93, 23, 10.1021/j100103a007 Kang, 1989, J. Chem. Phys., 5, 2824, 10.1063/1.455932 Rondanini, 2004, J. Cryst. Growth, 272, 52, 10.1016/j.jcrysgro.2004.08.051 Hansen, 2000, Phys. Rev. B, 62, 2869, 10.1103/PhysRevB.62.2869 Lam, 2001, Phys. Rev. B, 6403 D.G. Vlachos, Advances in Chemical Engineering, vol. 30, in press. Ventzek, 1993, Appl. Phys. Lett., 63, 605, 10.1063/1.109963 Bukowski, 1996, J. Appl. Phys., 80, 2614, 10.1063/1.363169 Miller, 1995, J. Res. Natl. Inst. Stand. Technol., 100, 427, 10.6028/jres.100.032 Lichtenberg, 1997, Plasma Sources Sci. Technol., 6, 437, 10.1088/0963-0252/6/3/022 Lichtenberg, 1994, J. Appl. Phys., 75, 2339, 10.1063/1.356252 Lee, 1995, J. Vac. Sci. Technol. A, 13, 368, 10.1116/1.579366 Kouznetsov, 1996, Plasma Sources Sci. Technol., 5, 662, 10.1088/0963-0252/5/4/008 Lee, 1997, J. Vac. Sci. Technol. A, 15, 113, 10.1116/1.580452 Kouznetsov, 1999, J. Appl. Phys., 86, 4142, 10.1063/1.371339 Lieberman, 1999, Appl. Phys. Lett., 75, 3617, 10.1063/1.125406 Chabert, 2001, Plasma Sources Sci. Technol., 10, 478, 10.1088/0963-0252/10/3/313 Chabert, 2003, J. Appl. Phys., 94, 831, 10.1063/1.1580196 Marakhtanov, 2003, J. Vac. Sci. Technol. A, 21, 1849, 10.1116/1.1613953 Kortshagen, 1999, IEEE Trans. Plasma Sci., 27, 1297, 10.1109/27.799806 Masi, 1992, J. Cryst. Growth, 124, 483, 10.1016/0022-0248(92)90504-C Benson, 1976 M. Di Stanislao, Ph.D. thesis, Chemical vapor deposition and plasma etching of thin solid films: from basic to applied, Politecnico di Milano, 2004. Peng, 1993, Israel J. Chem., 33, 449, 10.1002/ijch.199300051 Frisch, 1998 C. Cavalloti, Unpublished results. Zhang, 2000, J. Appl. Phys., 87, 1060, 10.1063/1.371980 Tuckerman, 1996, J. Phys. Chem., 100, 12878, 10.1021/jp960480+ Head-Gordon, 1996, J. Phys. Chem., 100, 13213, 10.1021/jp953665+ Tersoff, 1986, Phys. Rev. Lett., 56, 632, 10.1103/PhysRevLett.56.632 Voter, 2002, Annu. Rev. Mater. Res., 32, 321, 10.1146/annurev.matsci.32.112601.141541 Iannuzzi, 2003, Phys. Rev. Lett., 90, 10.1103/PhysRevLett.90.238302 Satake, 2003, J. Chem. Phys., 118, 6503, 10.1063/1.1559151 M. Masi, M. Di Stanislao, A. Veneroni, Prog. Cryst. Growth Charact. Mater. 47 (2005) 239–270.