Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering

Intermetallics - Tập 25 - Trang 86-94 - 2012
Ming Yang1, Mingyu Li2, Chunqing Wang2
1Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China
2State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, People's Republic of China

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