Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Bernstein, 1966, J Electrochem Soc, 113, 1282, 10.1149/1.2423806

Bernstein, 1966, Trans Metall Soc AIME, 236, 405

Roman JW, Eagar TW. In: Proceedings of the 1992 international symposium on microelectronics, San Francisco, CA; 19–21 October 1992. p. 52.

Lee, 1992, Thin Solid Films, 208, 202, 10.1016/0040-6090(92)90643-P

Humpston, 2004

Li, 2010, Acta Mater, 58, 3429, 10.1016/j.actamat.2010.02.018

Bartels, 1994, J Electron Mater, 23, 787, 10.1007/BF02651374

Lee, 1996, Thin Solid Films, 286, 213, 10.1016/S0040-6090(95)08502-5

Chen, 1996, Thin Solid Films, 283, 243, 10.1016/0040-6090(95)08531-9

Sommadossi S, Khanna PK, Bhatnagar SK, Litynska L, Zieba P, Gust W, Mittemeijer EJ. In: EUROMAT 99, Biannual meeting of the federation of European materials societies (FEMS), Munich, Germany, 27–30 September 1999; 2000. p. 214.

Lugscheider, 2001, Surf Coat Technol, 142–144, 813, 10.1016/S0257-8972(01)01182-3

Sommadossi, 2003, Mater Sci Technol, 19, 528, 10.1179/026708303225009706

Sommadossi, 2003, Mater Chem Phys, 81, 566, 10.1016/S0254-0584(03)00076-2

Bosco, 2004, Acta Mater, 52, 2965, 10.1016/j.actamat.2004.02.043

Bosco, 2005, Acta Mater, 53, 2019, 10.1016/j.actamat.2005.01.013

Lugscheider, 2003, Surf Coat Technol, 174–175, 704, 10.1016/S0257-8972(03)00692-3

Lugscheider, 2004, Adv Eng Mater, 6, 160, 10.1002/adem.200300538

Lugscheider, 2005, Surf Coat Technol, 200, 444, 10.1016/j.surfcoat.2005.02.193

Bobzin, 2006, Microsyst Technol, 12, 620, 10.1007/s00542-006-0079-1

Sommadossi, 2002, Mater Chem Phys, 77, 924, 10.1016/S0254-0584(02)00192-X

Sommadossi, 2007, Intermetallics, 15, 912, 10.1016/j.intermet.2006.10.050

Kato, 1999, Mater Sci Technol, 15, 851, 10.1179/026708399101506508

Kang, 2002, J Electron Mater, 31, 1238, 10.1007/s11664-002-0015-9

Deng, 2005, Metall Mater Trans A, 36A, 55, 10.1007/s11661-005-0138-8

Yu, 2005, J Alloys Comp, 392, 192, 10.1016/j.jallcom.2004.09.023

Prakash, 2001, Acta Mater, 49, 2481, 10.1016/S1359-6454(01)00146-X

Chuang, 2003, J Electron Mater, 32, 1426, 10.1007/s11664-003-0111-5

Takaku, 2004, Mater Trans, 45, 646, 10.2320/matertrans.45.646

Liang, 2006, Mater Trans, 47, 325

Dariavach, 2006, J Electron Mater, 35, 1581, 10.1007/s11664-006-0152-7

Li, 2006, Acta Mater, 54, 2907, 10.1016/j.actamat.2006.02.030

Kim, 1996, Phys Rev B, 53, 16027, 10.1103/PhysRevB.53.16027

Gusak, 2002, Phys Rev B, 66, 115403, 10.1103/PhysRevB.66.115403

Schaefer, 1998, J Electron Mater, 27, 1167, 10.1007/s11664-998-0066-7

Ghosh, 2001, Acta Mater, 49, 2609, 10.1016/S1359-6454(01)00187-2

Dybkov, 2001

Chada, 2000, J Electron Mater, 29, 1214, 10.1007/s11664-000-0015-6

Ma, 2002, J Appl Phys, 91, 3313

Binary Cu–Sn phase diagram. <http://www.crct.polymtl.ca/FACT/phase_diagram.php?file=Cu-Sn.jpg&dir=SGTE>.

Lanrila, 2005, Mater Sci Eng R, 49, 1, 10.1016/j.mser.2005.03.001

Ronka, 1998, Metall Mater Trans, 28A, 2951, 10.1007/s11661-998-0202-2

Mannan, 2004, Solder Surf Mount Technol, 16, 31, 10.1108/09540910410562509

Ghosh, 2000, J Appl Phys, 88, 6887, 10.1063/1.1321791

Watanabe, 1983, Acta Cryst, B39, 306, 10.1107/S0108768183002451

Zeng, 2002, Mater Sci Eng R, 38, 55, 10.1016/S0927-796X(02)00007-4

Wu, 2004, Mater Sci Eng R, 44, 1, 10.1016/j.mser.2004.01.001

Shang, 2009, Acta Mater, 57, 4697, 10.1016/j.actamat.2009.06.025

Lifshitz, 1961, J Phys Chem Solid, 19, 35, 10.1016/0022-3697(61)90054-3

Tikare, 1998, Acta Mater, 46, 1333, 10.1016/S1359-6454(97)00269-3

Li, 2007, Acta Mater, 55, 737, 10.1016/j.actamat.2006.09.003