Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes
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M. Gerber, C. Beddingfield, S. O’Connor, M. Yoo, M. Lee, D. Kang, S. Park, C. Zwenger, R. Darveaux, R. Lanzone, K. Park, Proc. Electron. Compon. Technol. Conf., 612-618 (2011). https://doi.org/10.1109/ECTC.2011.5898576
S.W. Kim, M. Detalle, L. Peng, P. Nolmans, N. Heylen, D. Velenis, A. Miller, G. Beyer, E. Beyne, Proc. Electron. Compon. Technol. Conf. (2016). https://doi.org/10.1109/ECTC.2016.205
C.F. Tseng, J.G. Duh, Mater. Sci. Eng. A 580, 169 (2013). https://doi.org/10.1016/j.msea.2013.05.058
J.W. Yoon, B.I. Noh, S.B. Jung, J. Electron. Mater. 40, 1950 (2011). https://doi.org/10.1007/s11664-011-1686-x
C.K. Huang, K.W. Lin, Y.M. Huang, A.R. Caparanga, R.B. Leron, M.H. Li, J. Electron. Mater. 42, 2648 (2013). https://doi.org/10.1007/s11664-013-2609-9
C.Y. Ho, J.G. Duh, C.W. Lin, C.J. Lin, Y.H. Wu, H.C. Hong, T.H. Wang, J. Mater. Sci. 48, 2724 (2013). https://doi.org/10.1007/s10853-012-7070-2
J.W. Yoon, J.H. Back, S.B. Jung, J. Mater. Sci. Mater. Electron. 29, 4724 (2018). https://doi.org/10.1007/s10854-017-8426-9
K. Pun, C.Q. Cui, 2009 Int. Conf. Electron. Packag. Technol. High Density Packag. ICEPT-HDP 2009 2, 1097 (2009). https://doi.org/10.1109/ICEPT.2009.5270593
P. Chi, Y. Li, H. Pan, Y. Wang, N. Chen, M. Li, L. Gao, Materials 14, 7874 (2021). https://doi.org/10.3390/ma14247874
C.E. Ho, C.W. Fan, W.Z. Hsieh, Surf. Coat. Technol. 259, 244 (2014). https://doi.org/10.1016/j.surfcoat.2014.04.027
A. Gross, N. Sitte, 20th Eur. Microelectron. Packag. Conf. EMPC 2015 13, 1 (2016)
J.H. Back, J.W. Yoon, J. Mater. Sci. Mater. Electron. 32, 24790 (2021). https://doi.org/10.1007/s10854-021-06936-w
J. Kim, J.H. Back, S.B. Jung, J.W. Yoon, J. Mater. Sci. Mater. Electron. 31, 4027 (2020). https://doi.org/10.1007/s10854-020-02950-6
X. Deng, R.S. Sidhu, P. Johnson, N. Chawla, Metall. Mater. Trans. A Phys. Metall. Mater. Sci. 36, 5–50 (2005). https://doi.org/10.1007/s11661-005-0138-8
W. Seo, K.H. Kim, Y.H. Kim, S. Yoo, J. Electron. Mater. 47, 110 (2018). https://doi.org/10.1007/s11664-017-5821-1
S.H. Kwon, K.D. Kim, D.G. Han, T.H. Sung, C.W. Lee, S. Yoo, 14th Int. Conf. Electron. Mater. Packag. EMAP 2012 5 (2012). https://doi.org/10.1109/EMAP.2012.6507909
J. Kim, S.B. Jung, J.W. Yoon, J. Alloys Compd. 805, 1013 (2019). https://doi.org/10.1016/j.jallcom.2019.07.184
J. Kim, S.B. Jung, J.W. Yoon, J. Alloys Compd. 820, 153396 (2020). https://doi.org/10.1016/j.jallcom.2019.153396
M. Ratzker, A. Pearl, M. Osterman, M. Pecht, G. Milad, J. Electron. Mater. 43, 3885 (2014). https://doi.org/10.1007/s11664-014-3322-z
S.H. Kwon, K.D. Kim, T.H. Lee, D.G. Han, T.H. Sung, C.W. Lee, S. Yoo, 14th Electron. Packag. Technol. Conf., EPTC 2012, 214 (2012). https://doi.org/10.1109/EPTC.2012.6507079
W. Seo, K.H. Kim, J.H. Bang, M.S. Kim, S. Yoo, J. Electron. Mater. 43, 4457 (2014). https://doi.org/10.1007/s11664-014-3395-8
Y.S. Wu, P.T. Lee, W.Z. Hsieh, T.T. Kuo, C.E. Ho, Surf. Coat. Technol. 359, 374 (2019). https://doi.org/10.1016/j.surfcoat.2018.12.043
C.F. Tseng, T.K. Lee, G. Ramakrishna, K.C. Liu, J.G. Duh, Mater. Lett. 65, 3216 (2011). https://doi.org/10.1016/j.matlet.2011.07.015
K. Zeng, R. Stierman, D. Abbott, M. Murtuza, 10th Inter. Conf. on Phenom. in Electron. Syst., ITHERM 2006, 1111 (2006). https://doi.org/10.1109/ITHERM.2006.1645469
P. Borgesen, L. Yin, P. Kondos, Microelectron. Reliab. 52, 1121 (2012). https://doi.org/10.1016/j.microrel.2011.12.005