Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling

Journal of Materials Research and Technology - Tập 15 - Trang 3974-3982 - 2021
Mu-lan Li1, Li-li Gao2, Liang Zhang1,3, Wei-min Long3, Su-juan Zhong3, Lei Zhang3
1School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou 221116, China
2Shanghai Institute of Radio Equipment, Shanghai 200090, China
3State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China

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