Insights into relationship between mechanical behavior and microstructure evolution of Sn-1.0Ag-0.5Cu-GNSs/Cu joint during thermal cycling
Tóm tắt
With electronic devices progressing into more miniaturized and intelligent, thermal cycling reliability of solder joint has always been an issue in high-density advanced packaging. In this study, minor amount of graphene nanosheets (GNSs) was added into Sn-1.0Ag-0.5Cu solder in order to enhance its thermal cycling reliability. Detailed relationship between mechanical behavior and microstructure evolution of the Sn-1.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu-GNSs solder joints was investigated. Experimental results indicated that Sn-1.0Ag-0.5Cu-GNSs had a lower decrease rate in shear force during thermal cycling when compared to the non-modified. This is due to a slower coarsening of microstructure and inhibited growth of interfacial IMCs. Theoretical analysis showed that with the addition of GNSs, the average growth coefficients of total interfacial IMCs (DT) was decreased from 8.6 × 10–11 to 6.7 × 10–11 cm2/h, respectively. This decrease in the average values of DT were mainly attributed to the pinning effect of GNSs on the the interfacial IMC growth during TC treatment. In addition, fracture mode of solder joints were also a good response to the mechanical change during thermal cycling treatment.
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