Inkjet printing as a deposition and patterning tool for polymers and inorganic particles

Soft Matter - Tập 4 Số 4 - Trang 703 - 2008
Emine Tekin1, Patrick J. Smith1, Ulrich S. Schubert1,2
1Laboratory of Macromolecular Chemistry and Nanoscience, Eindhoven University of Technology and Dutch Polymer Institute (DPI), PO Box 513, 5600 MB Eindhoven, The Netherlands
2Laboratory of Organic and Macromolecular Chemistry, Friedrich-Schiller-University Jena, Humboldtstr 10, 07743 Jena, Germany

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de Gans, 2004, Adv. Mater., 16, 203, 10.1002/adma.200300385

Dijksman, 1984, J. Fluid Mech., 139, 173, 10.1017/S0022112084000318

Fromm, 1984, IBM J. Res. Dev., 28, 322, 10.1147/rd.283.0322

Bogy, 1984, IBM J. Res. Dev., 28, 314, 10.1147/rd.283.0314

Antohe, 2002, J. Imaging Sci. Technol., 46, 409, 10.2352/J.ImagingSci.Technol.2002.46.5.art00003

Reis, 2005, J. Appl. Phys., 97, 094903, 10.1063/1.1888026

Wu, 2004, Mater. Trans. JIM, 45, 1801

Shin, 2003, J. Acoust. Soc. Am., 114, 1314, 10.1121/1.1603769

de Gans, 2004, Macromol. Rapid Commun., 25, 292, 10.1002/marc.200300148

Dijksman, 2007, J. Mater. Chem., 17, 511, 10.1039/B609204G

van Dam, 2004, Phys. Fluids, 16, 3403, 10.1063/1.1773551

Khatavkar, 2007, J. Fluid Mech., 572, 367, 10.1017/S0022112006003533

Xu, 2005, Phys. Rev. Lett., 94, 184505, 10.1103/PhysRevLett.94.184505

Deegan, 1997, Nature, 389, 827, 10.1038/39827

Deegan, 2002, Phys. Rev. E: Stat. Phys., Plasmas, Fluids, Relat. Interdiscip. Top., 62, 756, 10.1103/PhysRevE.62.756

Deegan, 2000, Phys. Rev. E: Stat. Phys., Plasmas, Fluids, Relat. Interdiscip. Top., 61, 475, 10.1103/PhysRevE.61.475

Sommer, 2005, Cryst. Growth Des., 5, 551, 10.1021/cg0496989

Hu, 2006, J. Phys. Chem. B, 110, 7090, 10.1021/jp0609232

Magdassi, 2005, Langmuir, 21, 10264, 10.1021/la0509044

Perelaer, 2006, Adv. Mater., 18, 2101, 10.1002/adma.200502422

Cuk, 2000, Appl. Phys. Lett., 77, 2063, 10.1063/1.1311954

Smith, 2006, J. Mater. Sci., 41, 4153, 10.1007/s10853-006-6653-1

de Gans, 2004, Langmuir, 20, 7789, 10.1021/la049469o

Tekin, 2004, J. Mater. Chem., 14, 2627, 10.1039/b407478e

Ko, 2004, Chem. Mater., 16, 4212, 10.1021/cm035256t

Park, 2006, Langmuir, 22, 3506, 10.1021/la053450j

van den Berg, 2007, J. Mater. Chem., 17, 677, 10.1039/B612158F

Duineveld, 2003, J. Fluid Mech., 477, 175, 10.1017/S0022112002003117

Goldin, 1969, J. Fluid Mech., 38, 689, 10.1017/S0022112069002540

Christanti, 2001, J. Non-Newtonian Fluid Mech., 100, 9, 10.1016/S0377-0257(01)00135-5

de Gans, 2005, Macromol. Rapid Commun., 26, 310, 10.1002/marc.200400503

Tekin, 2007, Adv. Funct. Mater., 17, 277, 10.1002/adfm.200600049

Reese, 2004, Mater. Today, 7, 20, 10.1016/S1369-7021(04)00398-0

Burns, 2003, MRS Bull., 28, 829, 10.1557/mrs2003.232

Wang, 2006, Appl. Phys. Lett., 88, 133502, 10.1063/1.2191088

Sele, 2005, Adv. Mater., 17, 997, 10.1002/adma.200401285

Yoshioka, 2006, Adv. Mater., 18, 1307, 10.1002/adma.200502362

Yoshioka, 2005, Macromol. Rapid Commun., 26, 238, 10.1002/marc.200400527

Sirringhaus, 2000, Science, 290, 2123, 10.1126/science.290.5499.2123

Sirringhaus, 2001, Mater. Res. Bull., 26, 539, 10.1557/mrs2001.127

Liu, 2005, Macromol. Rapid Commun., 26, 1955, 10.1002/marc.200500493

Chabinyc, 2005, Proc. IEEE, 93, 1491, 10.1109/JPROC.2005.851492

Arias, 2004, Appl. Phys. Lett., 85, 3304, 10.1063/1.1801673

Natori, 2005, Mater. Sci. Eng., B, 122, 231, 10.1016/j.mseb.2004.11.026

Plötner, 2004, Synth. Met., 147, 299, 10.1016/j.synthmet.2004.05.034

Xia, 2005, Macromolecules, 38, 6466, 10.1021/ma0503413

de Gans, 2006, Adv. Mater., 18, 910, 10.1002/adma.200502051

Hauschild, 2005, Small, 1, 1177, 10.1002/smll.200500093

Böhmer, 2006, Colloids Surf., A, 289, 96, 10.1016/j.colsurfa.2006.04.011

Marin, 2005, Macromol. Rapid Commun., 26, 319, 10.1002/marc.200400508

Tekin, 2005, Macromol. Rapid Commun., 26, 293, 10.1002/marc.200400507

Tekin, 2007, Adv. Funct. Mater., 17, 23, 10.1002/adfm.200600587

Tekin, 2006, J. Mater. Chem., 16, 4294, 10.1039/B610996A

Hong, 1997, Mater. Res. Soc. Symp. Proc., 471, 35, 10.1557/PROC-471-35

Redinger, 2004, IEEE Trans. Electron. Devices, 51, 1978, 10.1109/TED.2004.838451

Chung, 2004, Proc. HTFE

Chung, 2003, Proc. IMECE

Chung, 2004, Appl. Phys. A., 79, 1259, 10.1007/s00339-004-2731-x

Chung, 2004, Appl. Phys. Lett., 84, 801, 10.1063/1.1644907

Teng, 1988, IEEE Trans. Compon., Hybrids, Manuf. Technol., 11, 291, 10.1109/33.16656

Fuller, 2002, J. Microelectromech. Syst., 11, 54, 10.1109/84.982863

Szczech, 2002, IEEE Trans. Electron. Packag. Manufact., 25, 26, 10.1109/TEPM.2002.1000480

Kim, 2005, Electrochem. Solid-State Lett., 8, J30, 10.1149/1.2073670

Lee, 2006, Nanotechnology, 17, 2424, 10.1088/0957-4484/17/9/060

Dearden, 2005, Macromol. Rapid Commun., 26, 315, 10.1002/marc.200400445

Kamyshny, 2005, Macromol. Rapid Commun., 26, 281, 10.1002/marc.200400522

Lee, 2005, Nanotechnology, 16, 2436, 10.1088/0957-4484/16/10/074

Xue, 2006, Microelectron. Eng., 83, 298, 10.1016/j.mee.2005.09.002

Liu, 2005, Thin Solid Films, 478, 275, 10.1016/j.tsf.2004.11.077

Kordas, 2006, Small, 2, 1021, 10.1002/smll.200600061