Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Institute of Electrical and Electronics Engineers (IEEE) - Tập 31 Số 2 - Trang 370-381 - 2008
Thomas R. Bieler, Hairong Jiang, L.P. Lehman, T. Kirkpatrick, E. J. Cotts, Balaji Nandagopal

Tóm tắt

Từ khóa


Tài liệu tham khảo

cahn, 1996, Phys Metall

10.1007/BF00356683

vander voort, 1984, Metallography Principles and Practice, 292

10.1016/0001-6160(54)90179-0

10.1007/s11664-004-0094-x

10.1109/ECTC.2006.1645849

10.1007/s11661-002-0089-2

10.1016/S0921-5093(97)00424-3

10.1016/j.actamat.2006.11.023

lehman, 0, unpublished research

simmons, 1971, Single Crystal Elastic Constants and Calculated Aggregate Properties A Handbook

lee, 2005, Relationship between deformation and recrystallization textures of fcc and bcc metals, Philosoph Mag, 85, 297, 10.1080/14786430412331315734

rayne, 1960, Elastic constant of beta tin from 42 to 300 K, Phys Rev, 120, 1658, 10.1103/PhysRev.120.1658

10.1088/0508-3443/11/6/308

huntington, 1958, Solid State Physics, 7, 213, 10.1016/S0081-1947(08)60553-6

nye, 1957, Physical Properties of Crystals, 148

10.1080/00018732.1956.tADP0323

10.1121/1.1908524

10.1073/pnas.10.10.411

10.1007/s11664-002-0004-z

10.1016/j.msea.2006.09.037

10.1016/j.msea.2005.08.142

10.1007/s11664-004-0083-0

10.1007/s11664-002-0188-2

10.1557/JMR.2004.0222

10.1007/s11664-004-0081-2

10.1109/ECTC.2005.1441341

10.1557/JMR.2005.0361

ahat, 2001, Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn95.5 Ag3.8Cu0.7 solder joints, J Mater Res, 16, 2914

10.1023/B:JMSE.0000012461.69417.75

10.1115/1.1604802

10.1107/S0365110X62000742

10.1109/ECTC.2004.1319419

10.1007/s11664-004-0096-8

10.1016/j.msea.2005.10.009

10.1016/j.scriptamat.2005.01.043

10.1016/j.actamat.2005.02.024

10.1016/j.actamat.2007.01.028

10.1016/j.commatsci.2006.02.020

10.1007/s11837-005-0135-9

10.1007/s11664-003-0137-8

10.1557/JMR.2005.0361