Improving thermal conductivity of poly(vinyl alcohol) composites by using functionalized nanodiamond

Composites Communications - Tập 23 - Trang 100596 - 2021
Linhong Li1,2, Yue Qin1, Hao Wang1, Maohua Li1, Guichen Song1, Yuming Wu3, Xianzhe Wei1, Zulfiqar Ali1,2, Jian Yi1,2, Shulin Song4, Cheng-Te Lin1,2, Nan Jiang1,2, Jinhong Yu1,2
1Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China
2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, China
3School of Chemical Engineering, The University of Queensland, St Lucia, Queensland 4072, Australia
4National Engineering Laboratory of Carbon Fiber Preparation Technology, Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Ningbo, Zhejiang, 315201, China

Tài liệu tham khảo

Moore, 2013, Emerging challenges and materials for thermal management of electronics, Mater. Today, 17, 163, 10.1016/j.mattod.2014.04.003 Chen, 2016, Thermal conductivity of polymer-based composites: fundamentals and applications, Prog. Polym. Sci., 59, 41, 10.1016/j.progpolymsci.2016.03.001 Wang, 2019, A novel flexible room temperature positive temperature coefficient material for thermal management, Adv. Compos. Hybrid Mater., 2, 83, 10.1007/s42114-019-00081-z Zhou, 2020, Recent advances in thermal interface materials, ES Mater. Manuf., 7 Shtein, 2015, Graphene-based hybrid composites for efficient thermal management of electronic devices, ACS Appl. Mater. Interfaces, 7, 23725, 10.1021/acsami.5b07866 Feng, 2018, Synergetic improvement in thermal conductivity and flame retardancy of epoxy/silver nanowires composites by incorporating “branch-like” flame retardant-functionalized graphene, ACS Appl. Mater. Interfaces, 10, 21628, 10.1021/acsami.8b05221 Ruan, 2018, Improved thermal conductivities in polystyrene nanocomposites by incorporating thermal reduced graphene oxide via electrospinning-hot press technique, Compos. Commun., 10, 68, 10.1016/j.coco.2018.07.003 Xie, 2013, High thermal conductive polyvinyl alcohol composites with hexagonal boron nitride microplatelets as fillers, Compos. Sci. Technol., 85, 98, 10.1016/j.compscitech.2013.06.010 Balaji, 2019, Comparative mechanical, thermal, and morphological study of untreated and NaOH-treated bagasse fiber-reinforced cardanol green composites, Adv. Compos. Hybrid Mater., 2, 125, 10.1007/s42114-019-00079-7 Zhang, 2019, Modulating thermal transport in polymers and interfaces: theories, simulations, and experiments, ES Energy Environ., 5, 37 Kashfipour, 2020, Regulating intermolecular chain interaction of biopolymer with natural polyol for flexible, optically transparent and thermally conductive hybrids, Eng. Sci., 8, 11 Park, 2014, Electrical and thermal conductivities of reduced graphene oxide/polystyrene composites, Appl. Phys. Lett., 104, 113101, 10.1063/1.4869026 Qiu, 2018, Extremely low thermal conductivity of graphene nanoplatelets using nanoparticle decoration, ES Energy Environ., 2, 66 Tu, 2019, Latent heat and thermal conductivity enhancements in polyethylene glycol/polyethylene glycol-grafted graphene oxide composites, Adv. Compos. Hybrid Mater., 2, 471, 10.1007/s42114-019-00083-x Wang Li, 2007, The effect of particle size on the effective thermal conductivity of Al2O3-water nanofluids, J. Appl. Phys., 101, 10.1063/1.2436472 Hu, 2016, A novel approach for Al2O3/epoxy composites with high strength and thermal conductivity, Compo. Sci. Technol., 124, 36, 10.1016/j.compscitech.2016.01.010 Wang, 2011, Electronic properties of nanodiamond decorated graphene, ACS Nano, 6, 1018, 10.1021/nn204362p Mochalin, 2011, The properties and applications of nanodiamonds, Nat. Nanotechnol., 7, 1 Kidalov, 2009, Thermal conductivity of diamond composites, Materials, 2, 2467, 10.3390/ma2042467 Ruan, 2018, Improved thermal conductivities in polystyrene nanocomposites by incorporating thermal reduced graphene oxide via electrospinning-hot press technique, Compos. Commun., 10, 68, 10.1016/j.coco.2018.07.003 Macabutas, 2020, Determination of thermal conductivity of bamboo plyboard as thermal insulator for passive roof cooling, Adv. Compos. Hybrid Mater., 5, 24 Song, 2018, Aligned cellulose/nanodiamond plastics with high thermal conductivity, J. Mater. Chem. C., 6, 13108, 10.1039/C8TC04309D Zhang, 2019, Thermal conductivity enhancement of phase change materials with 3D porous diamond foam for thermal energy storage, Appl. Energy, 234, 208, 10.1016/j.apenergy.2018.10.036 Song, 2017, Significant enhancement of thermal conductivity in nanofibrillated cellulose films with low mass fraction of nanodiamond, ACS Appl. Mater. Interfaces, 9, 40766, 10.1021/acsami.7b09240 Wu, 2018, Effective thermal transport highway construction within dielectric polymer composites via a vacuum- assisted infiltration method, J. Mater. Chem. C., 6, 6494, 10.1039/C8TC01464G Wang, 2019, Highly thermally conductive fluorinated graphene films with superior electrical insulation and mechanical flexibility, ACS Appl. Mater. Interfaces, 11, 21946, 10.1021/acsami.9b07377 Mekonnen, 2013, Progress in bio-based plastics and plasticizing modifications, J. Mater. Chem. A., 1, 13379, 10.1039/c3ta12555f Shtein, 2015, Thermally conductive graphene-polymer composites: size, percolation, and synergy effects, Chem. Mater., 27, 2100, 10.1021/cm504550e Martín, 2009, General strategy for high-density covalent functionalization of diamond nanoparticles using Fenton chemistry, Chem. Mater., 21, 4505, 10.1021/cm9012602 Lee, 2014, Thermal conductivity improvement of surface-enhanced polyetherimide (PEI) composites using polyimide-coated h-BN particles, Phys. Chem., 16, 20041 Liang, 2009, A general procedure to functionalize agglomerating nanoparticles demonstrated on nanodiamond, ACS Nano, 3, 2288, 10.1021/nn900339s Mochalin, 2011, Covalent incorporation of aminated nanodiamond into an epoxy polymer network, ACS Nano, 5, 7494, 10.1021/nn2024539 Morimune, 2011, Poly(vinyl alcohol) nanocomposites with nanodiamond, Macromolecules, 44, 4415, 10.1021/ma200176r Murugesan, 2014, A carbon fiber solder matrix composite for thermal management of microelectronic devices, J. Mater. Chem. C, 2, 7184, 10.1039/C4TC00936C Ma, 2019, Largely enhanced thermal conductivity of ethylene-propylene-diene monomer composites by addition of graphene ball, Compos. Commun., 13, 119, 10.1016/j.coco.2019.04.005 Huang, 2012, Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites, J. Phys. Chem. C, 116, 13629, 10.1021/jp3026545 Bai, 2018, Effect of PLA crystallization on the thermal conductivity and breakdown strength of PLA/BN composites, ES Mater. Manuf., 3, 66 Liu, 2019, Graphene foam-embedded epoxy composites with significant thermal conductivity enhancement, Nanoscale, 11, 17600, 10.1039/C9NR03968F Yan, 2020, Seeking for low thermal conductivity atomic configurations in SiGe alloys with bayesian optimization, ES Energy Environ., 8 Zhao, 2018, Improved thermal stabilities, ablation and mechanical properties for carbon fibers/phenolic resins laminated composites modified by silicon-containing polyborazine, Eng. Sci., 2, 57 Zhou, 2019, Use of BN-coated copper nanowires in nanocomposites with enhanced thermal conductivity and electrical insulation, Adv. Compos. Hybrid Mater., 2, 46, 10.1007/s42114-019-00077-9 Wu, 2019, Cotton candy-templated fabrication of three-dimensional ceramic pathway within polymer composite for enhanced thermal conductivity, ACS Appl. Mater. Interfaces, 11, 44700, 10.1021/acsami.9b15758 Yeo, 2017, Characteristic correlation between liquid crystalline epoxy and alumina filler on thermal conducting properties, Compos. Sci. Technol., 141, 99, 10.1016/j.compscitech.2017.01.016 Huang, 2020, Tunable thermal-response shape memory bio-polymer hydrogels as body motion sensors, Eng. Sci., 9, 60 Feng, 2020, Establishment of multistage gradient modulus intermediate layer between fiber and matrix via designing double “rigid-flexible” structure to improve interfacial and mechanical properties of carbon fiber/resin composites, Compos. Sci. Technol., 200, 108336, 10.1016/j.compscitech.2020.108336 Shi, 2021, Enhancing interfacial performance of epoxy resin composites via in-situ nucleophilic addition polymerization modification of carbon fibers with hyperbranched polyimidazole, Compos. Sci. Technol., 201, 108522, 10.1016/j.compscitech.2020.108522 Chen, 2020, Constructing a “pea-pod-like” alumina-graphene binary architecture for enhancing thermal conductivity of epoxy composite, Chem. Eng. J., 381, 122690, 10.1016/j.cej.2019.122690 Li, 2020, Strong, tough and healable elastomer nanocomposites enabled by a hydrogen-bonded supramolecular network, Compos. Commun., 17, 100530, 10.1016/j.coco.2020.100530 Sato, 2015, Thermal conductivity enhancement of alumina/polyamide composites via interfacial modification, Ceram. Int., 41, 10314, 10.1016/j.ceramint.2015.04.088 Wu, 2017, Enhanced thermal transport performance for poly(vinylidene fluoride) composites with superfullerene, Fibers Polym., 18, 1180, 10.1007/s12221-017-7001-6 Ren, 2019, Silver nanoparticle-modified alumina microsphere hybrid composites for enhanced energy density and thermal conductivity, Compos. Appl. Sci. Manuf., 119, 299, 10.1016/j.compositesa.2019.02.004 Ren, 2018, Enhanced thermal conductivity for Ag-deposited alumina sphere/epoxy resin composites through manipulating interfacial thermal resistance, Compos. Appl. Sci. Manuf., 107, 561, 10.1016/j.compositesa.2018.02.010 Huang, 2019, A novel silver nanoparticle-deposited aluminum oxide hybrids for epoxy composites with enhanced thermal conductivity and energy density. Compos, Interfaces, 26, 11 Ren, 2017, Blocked isocyanate silane modified Al2O3/polyamide 6 thermally conductive and electrical insulation composites with outstanding mechanical properties, RSC Adv., 7, 29779, 10.1039/C7RA04454B Shen, 2018, Highly thermally conductive composite films based on nanofibrillated cellulose in situ coated with a small amount of silver nanoparticles, ACS Appl. Mater. Interfaces, 10, 24193, 10.1021/acsami.8b07249