INFLUENCE OF SUBSTRATE TEMPERATURE ON THE GROWTH OF Ti₄₅Ni₅₅ FILMS ON Ni SURFACES

Molecular dynamics simulations were employed to examine the influence of substrate temperature on the growth behavior of Ti₄₅Ni₅₅ thin films on stepped Ni(001) surfaces. Deposition cases were performed over a temperature range from 300 K to 1100 K under constant deposition energy and incident angle conditions. The results reveal that elevated temperatures facilitate interfacial intermixing, induce structural disorder, and lead to film amorphization. Furthermore, the presence of stepped surfaces significantly enhances atomic diffusion and mixing at the interface. These atomic-scale insights highlight the critical role of temperature in driving film evolution and support the potential formation of amorphous TiNi coatings.