High conductivity of isotropic conductive adhesives filled with silver nanowires

International Journal of Adhesion and Adhesives - Tập 26 - Trang 617-621 - 2006
H.P. Wu1, J.F. Liu1, X.J. Wu1, M.Y. Ge1, Y.W. Wang2, G.Q. Zhang1,3, J.Z. Jiang1
1Laboratory of New-Structured Materials, Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, PR China
2Analysis and Testing Center of Zhejiang University, Hangzhou 310027, PR China
3Center for Analysis, Zhejiang Sci-Tech University, Hangzhou 310018, PR China

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