Fused silica GRISMs manufactured by hydrophilic direct bonding at moderate heating
Tóm tắt
Từ khóa
Tài liệu tham khảo
Haisma, J., Spierings, B., Biermann, U., van Gorkum, A.: Diversity and feasibility of direct bonding: a survey of a dedicated optical technology. Applied Optics 33(7), 1154–1169 (1994)
Tong, Q.-Y., Gösele, U.: Semiconductor wafer bonding. Wiley, New York (1999)
Kalkowski, G., Risse, S., Zeitner, U., Fuchs, F., Eberhardt, R., Tünnermann, A.: Glass–glass direct bonding. ECS Transactions 64(5), 3–11 (2014)
Rothhardt, C., Rekas, M., Kalkowski, G., Haarlammert, N., Eberhardt, R., Tünnermann, A.: Fabrication of a high power Faraday isolator by direct bonding. Proc SPIE 8601, 86010T-1 (2013)
Zhang, X.X., Raskin, J.P.: Low-temperature wafer bonding: a study of void formation and influence on bonding strength. J Microelectromechan Syst 14(2), 368–382 (2005)
Kalkowski, G., Zeitner, U., Benkenstein, T., Fuchs, J., Rothhardt, C., Eberhardt, R.: Direct wafer bonding for encapsulation of fused silica optical gratings. Microelectron Eng 97, 177–180 (2012)
Vallin, Ö., Jonsson, K., Lindberg, U.: Adhesion quantification methods for wafer bonding. Mat Sci Eng R 50, 109–165 (2005)