Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis

Integration - Tập 70 - Trang 90-98 - 2020
Shaoyi Peng1, Ertugrul Demircan2, Mehul D. Shroff3, Sheldon X.-D. Tan1
1Electrical and Computer Engineering, University of California, Riverside, Riverside, CA 92521, USA
2Physical Verification Group, NXP Semiconductors Inc., Austin, TX, 78735, USA
3Intrinsic Reliability Group, NXP Semiconductors Inc., Austin, TX, 78735, USA

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