Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules

Journal of Power Electronics - Tập 14 Số 6 - Trang 1345-1356 - 2014
Moez Ayadi1,2, Sihem Bouguezzi3,4,5, Moez Ghariani1,2, Rafik Neji3,4,5
1Dept. of Electrical Engineering, National School of Electronic and Communication, University of Sfax, Sfax, Tunisia
2University of Sfax
3Dept. of Electrical Engineering, National School of Electronic and Communication, University of Sfax, Tunisia
4Dept. of Electrical Engineering, National School of Engineers of Sfax, Sfax, Tunisia
5Dept. of Electrical Engineering, National School of Engineers of Sfax, Tunisia

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Thông tin
Thông tin xuất bản

Journal of Power Electronics

Tập 14 Số 6

1345-1356

Thông tin tác giả