Epoxy Resin Containing Octamaleimidophenyl Polyhedral Oligomeric Silsesquioxane

Macromolecular Chemistry and Physics - Tập 206 Số 20 - Trang 2075-2083 - 2005
Yong Ni1, Sixun Zheng1
1Department of Polymer Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, P. R. China

Tóm tắt

AbstractSummary: Octamaleimidophenyl polyhedral oligomeric silsesquioxane (OmipPOSS) was synthesized via the imidization reaction between octaaminophenyl polyhedral oligomeric silsesquioxane (OapPOSS) and maleic anhydride, and it was characterized by means of Fourier transform infrared (FTIR) and NMR spectroscopies. OmipPOSS was further employed to prepare epoxy hybrids. The thermosetting hybrids containing OmipPOSS up to 10 wt.‐% were obtained via in situ polymerization of diglycidyl ether of bisphenol A (DGEBA) and 4,4′‐diaminodiphenylmethane (DDM) in the presence of OmipPOSS. High‐resolution transmission electronic microscopy (TEM) indicates that the nanometer‐scaled dispersion of POSS molecules was obtained, suggesting that the nanocomposites were successfully prepared. The results of DSC showed that the glass transition temperatures (Tg's) of the POSS‐containing nanocomposites are dependent on the content of POSS in the nanocomposites. When the contents of POSS are less than 5 wt.‐%, the nanocomposites displayed the enhanced glass transition temperatures (Tg's) in comparison with control epoxy. Thermogravimetric analysis (TGA) showed that all the nanocomposites containing POSS displayed improved char yield, suggesting the flame retardance of the materials is improved. magnified image

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Thông tin xuất bản

Macromolecular Chemistry and Physics

Tập 206 Số 20

2075-2083

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