Electrochemical Study of Spark Plasma-Sintered Copper Reinforced with Ni/SiC Micron-Sized Particles for Electrical Applications
Tóm tắt
In the research study, incorporation of Cu with hard SiC and Ni micron-sized particles was applied in the fabrication of a multifunctional copper-based metal matrix composite using spark plasma sintering. The developed spark plasma-sintered Cu–xNi and Cu–xNi–xSiC composite charateristics were studied by conducting morphological analysis, electrochemical, microhardness, and densification tests. Analytical equipments used include scanning electron microscopy, equipped elemental dispersive spectroscopy, X-ray diffractometry, and Vickers hardness tester. Electrochemical characterizations using potentiodynamic polarization for the electrochemical stability of the sintered composite in 0.5 M H2SO4 was also carried out. 96% densification and 90.20% corrosion resistance were obtained. The Cu–Ni composite showed an increase in corrosion resistance as a result of Ni addition in H2SO4 environment, while Cu–xNi–xSiC composite showed a slight decrease in corrosion resistance with excess SiC. It can be inferred that Cu–xNi and Cu–NixSiC composites improves the hardness values and corrosion resistance for electrical application when applied.
Tài liệu tham khảo
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