Effects of nanowire height on pool boiling performance of water on silicon chips

Wei, 2003, Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin-fins immersed in FC-72, Int. J. Heat Mass Transfer, 46, 4059, 10.1016/S0017-9310(03)00226-6

Liter, 2001, Pool-boiling CHF enhancement by modulated porous-layer coating: theory and experiment, Int. J. Heat Mass Transfer, 44, 4287, 10.1016/S0017-9310(01)00084-9

Li, 2007, Parametric study of pool boiling on horizontal highly conductive microporous coated surfaces, J. Heat Transfer, 129, 1465, 10.1115/1.2759969

Takata, 2003, Pool boiling on a superhydrophilic surface, Int. J. Energy Res., 27, 111, 10.1002/er.861

Davis, 2002, Ordered porous materials for. Emerging applications, Nature, 417, 813, 10.1038/nature00785

Vemuri, 2005, Pool boiling of saturated FC-72 on nano-porous surface, Int. Commun. Heat Mass Transfer, 32, 27, 10.1016/j.icheatmasstransfer.2004.03.020

Wu, 2010, Nucleate boiling heat transfer enhancement for water and FC-72 on titanium oxide and silicon oxide surfaces, Int. J. Heat Mass Transfer, 53, 1773, 10.1016/j.ijheatmasstransfer.2010.01.013

Chen, 2009, Pool boiling on the superhydrophilic surface with TiO2 nanotube arrays, Sci. China Ser. E-Tech Sci., 52, 1596, 10.1007/s11431-009-0195-0

Ujereh, 2007, Effects of carbon nanotube arrays on nucleate pool boiling, Int. J. Heat Mass Transfer, 50, 4023, 10.1016/j.ijheatmasstransfer.2007.01.030

Launay, 2006, Hybrid micro-nanostructured thermal interfaces for pool boiling heat transfer enhancement, Microelectronics J., 37, 1158, 10.1016/j.mejo.2005.07.016

Ahn, 2006, Pool boiling experiments on Multi Walled Carbon Nanotube (MWCNT) Forests, J. Heat Transfer-Transactions ASME, 128, 1335, 10.1115/1.2349511

Li, 2007, Nanostructured copper interfaces for enhanced boiling, Smll

Kim, 2010, Effects of nano-fluid and surfaces with nano structure on the increase of CHF, Exp. Therm. Fluid Sci., 34, 487, 10.1016/j.expthermflusci.2009.05.006

Chen, 2009, Nanowires for enhanced boiling heat transfer, Nano Lett., 9, 548, 10.1021/nl8026857

Im, 2010, Enhanced boiling of a dielectric liquid on copper nanowire surfaces, Int. J. Micro-Nano Scale Transport, 1, 79, 10.1260/1759-3093.1.1.79

Betz, 2010, Do surfaces with mixed hydrophilic and hydrophobic areas enhance pool boiling?, App. Phys. Lett., 97, 10.1063/1.3485057

Lu, 2011, Nanoscale surface modification techniques for pool boiling enhancement–A critical review and future directions, Heat Transfer Eng., 32, 10.1080/01457632.2011.548267

Yao, 2011, “Direct growth of copper nanowires on a substrate for boiling applications”, Micro & Nano Lett., 6, 562, 10.1049/mnl.2011.0136

Tyrrell, 2001, Images of nanobubbles on hydrophobic surfaces and their interactions, Phys. Rev.Lett., 87, 176104, 10.1103/PhysRevLett.87.176104

Holmberg, 2003, Nanobubble trouble on gold surface, Langmuir, 19, 10510, 10.1021/la0352669

Peng, 2006, Metal particle induced, highly localized site-specific etching of Si and formation of single-crystalline Si nanowires in aqueous fluoride solution, Chem. Eur. J, 12, 7942, 10.1002/chem.200600032

Li, 2000, Metal-assisted chemical etching in HF/H2O2 produces porous silicon, Appl. Phys. Lett., 77, 2572, 10.1063/1.1319191

Cheng, 2008, A study of the synthesis, characterization, and kinetics of vertical silicon nanowire arrays on (001) Si substrates, J. Electrochem. Soc., 155, D711, 10.1149/1.2977548

Cooke, 2011, Pool boiling heat transfer and bubble dynamics over plain and enhanced microchannels, J. Heat Transfer, 133, 10.1115/1.4003046

Theofanous, 2002, The boiling crisis phenomenon, Exp. Therm. Fluid Sci., 26, 775, 10.1016/S0894-1777(02)00192-9

Hsu, 1962, On the size range of active nucleation cavities on a heating surface, J. Heat Transfer, 207, 10.1115/1.3684339

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