Effects of manufacturing defects on the device failure rate

Aban, 2006, Parametric estimation for the truncated Pareto distribution, Journal of the American Statistical Association, 101, 270, 10.1198/016214505000000411 Adamidis, 1998, A lifetime distribution with decreasing failure rate, Statistics & Probability Letters, 39, 35, 10.1016/S0167-7152(98)00012-1 Barnett, 2003, Extending integrated-circuit yield models to estimate early life reliability, IEEE Transactions on Reliability, 52, 296, 10.1109/TR.2003.816418 Block, 2003, Initial and final behavior of failure rate functions for mixtures and systems, Journal of Applied Probability, 40, 721, 10.1239/jap/1059060898 Carrasco, 2008, A generalized modified Weibull distribution for lifetime modeling, Computational Statistics and Data Analysis, 53, 450, 10.1016/j.csda.2008.08.023 Chang, 2000, Optimal burn-in decision for products with an unimodal failure rate function, European Journal of Operational Research, 126, 534, 10.1016/S0377-2217(99)00308-2 Chen, 2000, A new two-parameter lifetime distribution with bathtub shape or increasing failure rate function, Statistics & Probability Letters, 49, 155, 10.1016/S0167-7152(00)00044-4 Forbes, K. R., & Arguello, N. (2003). Using time-dependent reliability fallout as a function of yield to optimize burn-in for a 130 nm SRAM device. In Integrated reliability workshop final report, IEEE international (pp. 61–66). Ghaida, 2009, Random yield prediction based on a stochastic layout sensitivity model, IEEE Transactions on Semiconductor Manufacturing, 22, 329, 10.1109/TSM.2009.2024821 Glaser, 1980, Bathtub and related failure rate characterizations, Journal of the American Statistical Association, 75, 667, 10.1080/01621459.1980.10477530 Gnedenko, 1969 Houghton, 1988, Use of the truncated shifted Pareto distribution in assessing size distribution of oil and gas fields, 907 ITRS Update (2006). International technology roadmap for semiconductors. Report international technology roadmap for semiconductors. Kim, 2011, Burn-in considering yield loss and reliability gain for integrated circuits, European Journal of Operational Research, 212, 337, 10.1016/j.ejor.2011.01.028 Kim, 2009, Optimal burn-in for maximizing reliability of repairable non-series systems, European Journal of Operational Research, 126, 140, 10.1016/j.ejor.2007.10.037 Kim, 2004, A relation model of gate oxide yield and reliability, Microelectronics and Reliability, 44, 425, 10.1016/j.microrel.2003.09.009 Kim, 2008, Reliability functions estimated from commonly used yield models, Microelectronics and Reliability, 48, 481, 10.1016/j.microrel.2007.08.001 Kwona, 2010, Optimal burn-in with random minimal repair cost, Journal of the Korean Statistical Society, 39, 245, 10.1016/j.jkss.2009.08.002 Linder, 2004, Statistics of progressive breakdown in ultra-thin oxides, Microelectronic Engineering, 72, 24, 10.1016/j.mee.2003.12.010 Marshall, 2007 Murthy, 1997, Parametric study of sectional models involving two Weibull distributions, Reliability Engineering and System Safety, 56, 151, 10.1016/S0951-8320(96)00114-7 Petersen, 2001, The laws of defect-size distribution in the failure of materials, Doklady Physics, 46, 369, 10.1134/1.1378107 Reinhardt, 2008 Sachdev, 2007 Sheu, 2005, Optimal burn-in time to minimize the cost for general repairable products sold under warranty, European Journal of Operational Research, 163, 445, 10.1016/j.ejor.2003.06.043 Tiryakioglu, 2006, On the relationship between statistical distributions of defect size and fatigue life in 7050-T7451 thick plate and A356-T6 casting, Materials Science and Engineering A, 432, 59