Effect of solidification temperature range on the dendritic growth mode

Science China Physics, Mechanics & Astronomy - Tập 54 - Trang 89-94 - 2010
ChongDe Cao1, Fang Wang2, LiBing Duan1, XiaoJun Bai1
1Department of Applied Physics, Northwestern Polytechnical University, Xi’an, China
2School of Computer Science and Technology, Northwestern Polytechnical University, Xi’an, China

Tóm tắt

Electromagnetic levitation technique was used to undercool bulk samples of Co-20% Cu and Co-60% Cu alloys and high undercoolings up to 303 and 110 K were achieved, respectively. The dendritic growth velocities were measured as a function of undercooling. The dendrite growth velocity of the Co-20% Cu alloy was much higher than that of the Co-60% Cu alloy. The experimental data were analyzed on the basis of the LKT/BCT dendritic growth model by taking into account non-equilibrium interface kinetics. It has been revealed that a transition from solute diffusion controlled dendritic growth to thermal diffusion controlled dendritic growth occurs at an undercooling of about 66 K for the Co-20% Cu alloy, whereas the dendrite growth in Co-60% Cu alloy proceeds in a solute diffusion controlled mode within a large solidification temperature range, and the solutal undercooling plays a dominant role. It is thus deduced that certain distinct solidification temperature ranges may be responsible for the different solidification modes for the two alloys.

Tài liệu tham khảo

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