Effect of non-standard SnAg surface finishes on properties of solder joints

Applied Surface Science Advances - Tập 18 - Trang 100483 - 2023
Alena Pietrikova1, Daniel Dzivy1, Peter Provazek1, Lubomir Livovsky1, Robert Dzunda2, Karel Dusek3, David Busek3
1Department of Technologies in Electronics, Technical University of Kosice, Kosice, Slovak Republic
2Institute of Materials Research, Kosice, Slovak Republic
3Department of Electrotechnology, Czech Technical University in Prague, Czechia

Tài liệu tham khảo

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