Dynamic analysis for a vertical interface crack and the nearby circular cavity located at the piezoelectric bi-material half-space under SH-waves
Tóm tắt
The present problem aims to study the scattering behavior of SH-waves by a circular cavity near two symmetrically permeable interface cracks in the piezoelectric bi-material half-space. The steady-state response of the problem is obtained, with the aid of the Green’s function method and the complex function method. Above all, the essential expression of Green’s function is constructed by the mirror method. This expression satisfies the conditions of being stress-free and electric insulation on the horizontal boundary of the orthogonal space where the circular cavity is located, and the condition of bearing a harmonic out-plane line source force on the vertical boundary. Next, on the basis of dividing the bi-material medium into two parts along the vertical boundary, the first kind of Fredholm integral equation with uncertain anti-plane forces is established by using the conjunction method and the crack-division technology. Then, the solution is obtained by solving an algebraic equation with finite terms, which is an effective truncation of the integral equation. Finally, the dynamic stress concentration factor around the edge of the circular cavity and the dynamic stress intensity factor at the crack tip are calculated numerically. On this basis, the effects of incident wave frequency, crack length, crack location and circular cavity position on the dynamic stress concentration factor and dynamic stress intensity factor are discussed.
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