Dismantlement behavior and strength of dismantlable adhesive including thermally expansive particles

International Journal of Adhesion and Adhesives - Tập 23 - Trang 377-382 - 2003
Yuichi Nishiyama1, Nobuyuki Uto2, Chiaki Sato3, Hiroaki Sakurai4
1Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan
2Kaken Tech Co., Ltd., 901 Shimofutamata-cho, Yokaichi-shi, Shiga 527-0065, Japan
3Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan
4Fuji Industrial Research Institute, 2590-1 Obuchi, Fuji-shi, Shizuoka 417-8550, Japan

Tài liệu tham khảo

USP 5,242,637, E. Patent 0407 996. USP 4,844,833, J. Patent 2,131,217 and 2,136,376. Sakurai, 1998, Evaluation of adhesive properties of elastomeric adhesive. The development and utilization of the removable adhesive, Bulletin of Shizuoka Industrial Technology Research Center, 43, 11 Ishikawa H. Development of bonding and debonding technology meeting recycle requirements. Proceedings of JSME Colloquium No. 01-86, 2001. p. 5–8 [in Japanese]. Hanafi M, Nishiyama Y, Sato C. Fracture mechanism of joints bonded by dismantlable adhesive including thermally expansive particles. Proceedings of EURADH 2002, Glasgow/UK, 2002. p. 133–6.
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International Journal of Adhesion and Adhesives

Tập 23

377-382

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