Dielectric behaviours of multi-doped BaTiO3/epoxy composites
Tài liệu tham khảo
Chahal, 1998, IEEE Transaction on Components, Packaging, and Manufacturing Technology, B 21, 184, 10.1109/96.673707
Bhattacharya, S., Tummala, R. R., Chahal, P. and White, G., International symposium on Advanced Packaging Materials, 1997, 68–70.
Kinoshita, 1976, J. Appl. Phys., 47, 371, 10.1063/1.322330
Buessem, 1966, J. Am. Ceram. Soc., 49, 33, 10.1111/j.1151-2916.1966.tb13144.x
Morrison, 1998, J. Am. Ceram. Soc., 8, 1957, 10.1111/j.1151-2916.1998.tb02575.x
Moulson, A. J. and Herbert, J. M., Electroceramics: Materials, Properties, Applications, Chapman & Hall, 1990 (Section 5.7.4).
Goodman, 1981, Advances in Ceramics, Am. Ceram. Soc., 1, 215
Yen, 1995, Jpn. J. Appl. Phys., 34, 6149, 10.1143/JJAP.34.6149
Hsiang, 1996, J. Am. Ceram. Soc., 79, 1053, 10.1111/j.1151-2916.1996.tb08547.x
Arlt, 1985, J. Appl. Phys., 58, 1619, 10.1063/1.336051
Hsiang, 1993, Jpn. J. Appl. Phys., 32, 5029, 10.1143/JJAP.32.5029
Kuo, D. H ., Chang, C. C., Su, T. Y., Wang, W. K. and Lin, B. Y., submitted to Mater. Sci. Eng. B.
Muralidhar, 1987, J. Mater. Sci. Lett., 6, 1243, 10.1007/BF01794576
