Cure kinetics and viscosity modelling of a high-performance epoxy resin film

Weimer, 2008, Material, process and technology development for future helicopter applications, 65 Younossi, 2001 Opalicki, 1996, Cure kinetics of neat and carbon-fiber-reinforced TGDDM/DDS epoxy systems, Journal of Applied Polymer Science, 61, 1025, 10.1002/(SICI)1097-4628(19960808)61:6<1025::AID-APP17>3.0.CO;2-V Henne, 2003 Roller, 1975, Characterization of the time-temperature-viscosity behavior of curing B-staged epoxy resin, Polymer Engineering & Science, 15, 406, 10.1002/pen.760150603 Hexcel Composites, Material Safety Data Sheet (MSDS), HexPly M18-1, in: E.P.S. Department (Ed.), 9/2003. DIN EN 6043, European Standard, 1996 López, 2009, Polymer blends based on an epoxy-amine thermoset and a thermoplastic, Journal of Thermal Analysis and Calorimetry, 95, 369, 10.1007/s10973-008-9237-2 Ellis, 1993 Su, 1995, Cure kinetics and morphology of amine-cured tetraglycidyl-4,4′-diaminodiphenylmethane epoxy blends with poly(ether imide), Polymer, 36, 2883, 10.1016/0032-3861(95)94337-S Kamal, 1973, Kinetics and thermal characterization of thermoset cure, Polymer Engineering & Science, 13, 59, 10.1002/pen.760130110 Kim, 2005, Cure kinetics and mechanical properties of the blend system of epoxy/diaminodiphenyl sulfone and amine terminated polyetherimide-carboxyl terminated poly(butadiene-co-acrylonitrile) block copolymer, Korean Journal of Chemical Engineering, 22, 755, 10.1007/BF02705795 Varley, 2007, Reaction kinetics and phase transformations during cure of a thermoplastic-modified epoxy thermoset, Macromolecular Materials and Engineering, 292, 46, 10.1002/mame.200600275 Liu, 2001, A new curing kinetic model and its application to BPSER/DDM epoxy system, Journal of Thermal Analysis and Calorimetry, 65, 837, 10.1023/A:1011984317337 S. Sabzevari, S. Alavi-Soltani, B. Minaie, Effect of thermoplastic toughening agent on glass transition temperature and cure kinetics of an epoxy prepreg, Journal of Thermal Analysis and Calorimetry, 1–7. Chern, 1987, A kinetic model for curing reactions of epoxides with amines, Polymer Engineering & Science, 27, 788, 10.1002/pen.760271104 Halley, 1996, Chemorheology of thermosets – an overview, Polymer Engineering and Science, 36, 593, 10.1002/pen.10447 Yousefi, 1997, Kinetic studies of thermoset cure reactions: a review, Polymer Composites, 18, 157, 10.1002/pc.10270 Castro, 1982, Studies of mold filling and curing in the reaction injection molding process, The American Institute of Chemical Engineers (AIChE) Journal, 28, 250, 10.1002/aic.690280213 Caba, 1998 Du, 2004, Cure kinetics of epoxy resin used for advanced composites, Polymer International, 53, 1343, 10.1002/pi.1533 Schneider, 1979, DSC and TBA studies of the curing behavior of two dicy-containing epoxy resins, Polymer Engineering & Science, 19, 304, 10.1002/pen.760190413 Hubert, 2001 Lee, 1982, Heat of reaction, degree of cure, and viscosity of hercules 3501-6 resin, Journal of Composite Materials, 16, 510, 10.1177/002199838201600605 Yu, 2008, Rheological study of epoxy systems blended with poly(ether sulfone) of different molecular weights, Industrial & Engineering Chemistry Research, 47, 9361, 10.1021/ie800845p Bonnet, 1999, Epoxy−diamine thermoset/thermoplastic blends. 2. Rheological behavior before and after phase separation, Macromolecules, 32, 8524, 10.1021/ma981755h Kim, 2000, Rheological behavior during the phase separation of thermoset epoxy/thermoplastic polymer blends, Korea-Australia Rheology Journal, 12, 77 Hubert, 2001 Nguyen-Thuc, 2004, Elastomer-modified epoxy/amine systems in a resin transfer moulding process, Polymer International, 53, 591, 10.1002/pi.1437 Thompson, 2004 Garschke, 2012, Out-of-autoclave cure cycle study of a resin film infusion process using in situ process monitoring, Composites Part A: Applied Science and Manufacturing, 43, 935, 10.1016/j.compositesa.2012.01.003