Creep deformation characteristics of tin and tin-based electronic solder alloys
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science - Tập 36 - Trang 99-105 - 2005
Tóm tắt
Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n=7.6, 5.0, and 5.0) and activation energy (Q
c
=60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q
c
values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays.
Tài liệu tham khảo
P.T. Vianco and D.R. Frear: J. Met., 1993, vol. 45, pp. 14–19.
L.E. Felton, C.H. Taeder, and D.B. Knorr: J. Met., 1993, vol. 45, pp. 28–32.
K.L. Murty, H. Yang, P. Deane, and P. Magill: EEP-Vol. 19-1, Advanced Electronic Packaging, ASME, Philadelphia, PA, 1997, pp. 1221–31.
R.N. Wild: Report Nos. IBM/73Z00421 and 74Z0048, New York, NY, 1973.
D. Hanson and E.J. Sanford: J. Inst. Met., 1938, vol. 62, pp. 215–37.
J.S. Hwang: Solder Paste in Electronic Packaging, van Nostrand Reinhold, New York, NY, 1989.
K.L. Murty and I. Turlik: Proc. J. ASME/JSME, 1992, vol. 1, pp. 309–18.
E.S. Hedges: Tin and Its Alloys, Edward Arnold Publishers Ltd., London, 1960, p. 53.
J. Askill: Tracer Diffusion Data for Metals, Alloys and Simple Oxides, IFI Plenum, New York, NY, 1970, pp. 31–41.
O.D. Sherby: Acta Metall., 1979, vol. 27, pp. 387–94.
J.E. Bird, A.K. Mukherjee, and J.E. Dorn: Quantitative Relation between Properties and Microstructure, Israel University Press, Jerusalem, 1969, pp. 255–82.
K.L. Murty: in Creep and Fracture of Engineering Materials and Structures, J.C. Earthman and F.A. Mohamed, eds., TMS, Warrendale, PA, 1997, pp. 739–47.
K.L. Murty and O. Kanert: J. Appl. Phys., 1990, vol. 67, pp. 2866–92.
J.E. Breen and J. Weertman: J. Met., 1955, vol. 72, pp. 1230–34.
P.J. Fensham: Austr. J. Sci. Res., 1950, vol. 3A, p. 91.
J.D. Meakin and E. Klokholm: Trans. TMS-AIME, 1960, vol. 218, pp. 463–66.
G. Pawlicki: Nukleonika, 1967, vol. 12, p. 1123.
C. Coston and N.H. Nachtrieb: J. Phys. Chem., 1964, vol. 68, p. 1123.
S.Z. Bokhstein, S.T. Kishkin, and L.M. Moroz: Investigation of the Structure of Metals by Radioactive Isotope Methods, State Publishing House, Moscow, 1961.
W. Chomba and J. Andrewskiewicz: Nukleonika, 1960, vol. 5, p. 611.
R.E. Frenkel, O.D. Sherby, and J.E. Dorn: Acta Metall., 1955, vol. 3, p. 470.
F.A. Mohamed, K.L. Murty, and J.W. Morris: Metall. Trans., 1973, vol. 4, pp. 935–39.
P. Adeva, G. Caruanan, O.A. Ruano, and M. Torralba: Mater. Sci. Eng. A, 1995, vol. 194, pp. 17–23.
V. Raman and R. Berriche: J. Mater. Res., 1992, vol. 7, pp. 627–38.
S.N.G. Chu and J.C.M. Li: Mater. Sci. Eng., 1979, vol. 39, pp. 1–10.
S.H. Suh, J.B. Cohen, and J. Weertman: Metall. Trans. A, 1983, vol. 14A, p. 117.
O.D. Sherby and P.M. Burke: Progr. Mater. Sci., 1967, vol. 1, pp. 325–90.
D. Grivas, K.L. Murty, and J.W. Morris: Acta Metall., 1979, vol. 27, pp. 731–37.
R. Darveaux: IEEE Trans. Components, Hybrids Manufacturing Technol., 1992, vol. 15, pp. 1013–24.
K.L. Murty: Scripta Metall., 1973, vol. 7, pp. 899–903.
T.G. Langdon: Dislocations and Properties, The Institute of Metals, London, 1985, 221–37.
K.L. Murty, H. Yang, H.P. Deane, and L. Turlik: Proc. 3rd Pacific Rim Int. Conf. on Advanced Materials and Processing (PRICM), M.A. Imam, et al., TMS, Warrendale, 1997, vol. II, pp. 2581–88.
K.L. Murty, M.D. Mathew, Y. Wang, and F.M. Haggag: in Modeling the Mechanical Response of Structural Materials, Eric M. Taleff and Rao K. Mahidhara, eds., TMS, Warrendale, PA, 1998, pp. 145–52.
O.D. Sherby and J. Weertman: Acta Metall., 1979, vol. 27, p. 387.