Jin Liang, N Gollhardt, P. S. Lee, S. A. Schroeder and W. L. Morris in Applications of Experimental Mechanics to Electronic Packaging, edited by J. C. Suhling, ASME (1995) p.1–9.
B. F. Dyson and M. McClean, ISO International, 8, No.10, p.802 (1990).
H. J. Frost and M. F. Ashby, Deformation Mechanisms Maps. Pergamon Press (1982).
E. P. Busso, Modelling Non-Steady Creep Behaviour Based on Mechanistic (Damage) Considerations. Report No. M1741/R01, WS Atkins Science and Technology (1992).